Part A
10AX016E4F27E3SG
Intel
- Lifecycle
- Active
- Stock
- 2616 PCS
- Package
- FBGA-672
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10AX016E4F27E3SG and 10AX032E2F27E1SG are both Intel Arria 10 GX FPGA devices sharing the same 672-pin FBGA package and core architecture, but they differ in logic density, speed grade, and operating temperature range. The 10AX032E2F27E1SG offers higher logic capacity and a faster speed grade, making it a viable functional upgrade candidate where additional resources and performance are required, provided thermal and power budgets are validated.
Logic Density
Validation required
Speed Grade
Validation required
Package Type
High match
Operating Temperature
Not compatible
Parts at a glance
Part B
10AX032E2F27E1SG
Intel
- Lifecycle
- Active
- Stock
- 6764 PCS
- Package
- BBGA-672
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10AX016E4F27E3SG | 10AX032E2F27E1SG | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 160,000 | 320,000 | Logic capacity determines the maximum complexity of the digital design that can be implemented; a device with half the logic elements cannot substitute for a design that requires the larger capacity. |
| Total RAM Bits | 8,800,000 | 17,700,000 | On-chip memory limits the amount of buffering, FIFOs, and data storage available; designs needing more embedded memory cannot fit in the smaller device. |
| DSP Blocks | 156 | 312 | DSP blocks determine signal-processing throughput; a design requiring more multipliers/accumulators than available cannot be mapped onto the smaller device. |
| Speed Grade | 4 | 2 | Speed grade affects maximum achievable clock frequency and timing closure; a slower grade may fail timing where a faster grade succeeds, so they are not directly interchangeable. |
| Operating Temperature Range | 0°C to 100°C (extended commercial) | 0°C to 100°C (extended commercial) | The temperature range must match the application environment; industrial or automotive deployments require parts rated beyond commercial limits. |
| Package | 672-FBGA (27x27) | 672-FBGA (27x27) | Package footprint and pinout must match the PCB layout; a different package would require board redesign and cannot be dropped in. |
| Supply Voltage | 0.87V to 0.93V core | 0.87V to 0.93V core | Core voltage must match the board's power delivery design; a mismatch can cause unreliable operation or damage. |
| Transceiver Count | 12 | 12 | High-speed serial transceivers enable protocols such as PCIe and Ethernet; the count limits how many high-speed links the design can support. |
| Maximum User I/O | 240 | 240 | Available I/O pins constrain how many external interfaces and peripherals can be connected to the device. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10AX016E4F27E3SG | 10AX032E2F27E1SG |
|---|---|---|
| Supplier | - | Intel |
| Series | Arria 10 GX | Arria 10 GX |
| Part Status | Active | Discontinued at Digi-Key |
| Number of LABs/CLBs | 61510 | 119900 |
| Number of Logic Elements/Cells | 160000 | 320000 |
| Total RAM Bits | 10086400 | 21040128 |
| Number of I/O | 240 | 240 |
| Voltage - Supply | 0.87V ~ 0.93V | 0.87V ~ 0.98V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) | 0°C ~ 100°C (TJ) |
Frequently asked questions
What are the 10AX016E4F27E3SG and 10AX032E2F27E1SG devices?
Both are Intel (formerly Altera) Arria 10 GX series field-programmable gate arrays (FPGAs) in the 672-pin FBGA package with a 27 mm x 27 mm body. The 10AX016E4F27E3SG has approximately 160,000 logic elements, while the 10AX032E2F27E1SG has approximately 320,000 logic elements.
What is the difference in logic density between the 10AX016E4F27E3SG and 10AX032E2F27E1SG?
The 10AX016E4F27E3SG provides roughly 160,000 logic elements, whereas the 10AX032E2F27E1SG provides roughly 320,000 logic elements. The 10AX032E2F27E1SG therefore offers approximately twice the logic capacity of the 10AX016E4F27E3SG.
Do the 10AX016E4F27E3SG and 10AX032E2F27E1SG use the same package and pinout?
Yes. Both devices are offered in the same 672-pin FBGA package with a 27 mm x 27 mm footprint. However, pinout compatibility must be verified against the specific device pinout files, because I/O bank assignments and transceiver channel mapping can differ between density variants.
What are the speed grade and temperature grade differences between the 10AX016E4F27E3SG and 10AX032E2F27E1SG?
The 10AX016E4F27E3SG is specified with speed grade 3 and extended temperature range. The 10AX032E2F27E1SG is specified with speed grade 2 and industrial temperature range. Speed grade 2 is faster than speed grade 3, and the industrial temperature range differs from the extended temperature range, so timing closure and thermal design must be re-evaluated if substituting one for the other.
Can the 10AX016E4F27E3SG be used as a direct drop-in replacement for the 10AX032E2F27E1SG?
No. Although both are Arria 10 GX FPGAs in the same 672-pin FBGA package, they differ in logic density, speed grade, and temperature grade. A direct drop-in replacement is not possible without recompiling the design, re-verifying pin assignments, and confirming that the target device meets the timing, power, and thermal requirements of the application.
Are the 10AX016E4F27E3SG and 10AX032E2F27E1SG pin-to-pin compatible?
They share the same package footprint, but full pin-to-pin compatibility is not guaranteed. The 10AX032E2F27E1SG may use additional I/O or transceiver pins that are not bonded out or not available on the 10AX016E4F27E3SG. Always consult the respective device pinout files and the Arria 10 device handbook before designing a common PCB footprint.
Which device is better for high-logic-density applications?
The 10AX032E2F27E1SG is better suited for high-logic-density applications because it provides approximately 320,000 logic elements, which is about twice the logic capacity of the 10AX016E4F27E3SG. The 10AX016E4F27E3SG is more appropriate for designs that require lower logic density and can benefit from its extended temperature range and speed grade 3 characteristics.
What configuration methods are supported by both the 10AX016E4F27E3SG and 10AX032E2F27E1SG?
Both devices support standard Arria 10 configuration schemes, including active serial (AS), passive serial (PS), fast passive parallel (FPP), and configuration via a host processor or CPLD. They also support partial reconfiguration and remote system upgrade features as documented in the Intel Arria 10 configuration user guide.