Part A
10AX048H2F34E2SG
Altera
- Lifecycle
- Active
- Stock
- 4660 PCS
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10AX048H2F34E2SG and 10AX032E1F27E1SG are both Intel Arria 10 GX FPGA devices sharing the same core architecture, transceiver technology, and 20 nm process node, making them functionally related candidates. However, they differ in logic density, package footprint, speed grade, and operating temperature range, so the 10AX032E1F27E1SG cannot serve as a direct drop-in replacement for the 10AX048H2F34E2SG without design validation. The lower-density device may be suitable only where reduced logic capacity, fewer transceiver channels, and a smaller package are acceptable, and the differing speed grade and temperature grade must be verified against the target application requirements.
Logic Density
Validation required
Package Type
Not compatible
Speed Grade
Validation required
Operating Temperature
Validation required
Parts at a glance
Part B
10AX032E1F27E1SG
Intel
- Lifecycle
- Active
- Stock
- 7390 PCS
- Package
- BBGA-672
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10AX048H2F34E2SG | 10AX032E1F27E1SG | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 480,000 | 320,000 | Logic capacity determines how much custom digital logic can be implemented; a smaller device may not fit a design built for a larger one. |
| Adaptive Logic Modules (ALM) | 183,590 | 122,400 | ALMs are the fundamental logic building blocks; fewer ALMs limit the achievable logic density and complexity. |
| Total Embedded Memory | 28,080 Kbit | 18,720 Kbit | On-chip memory affects buffering, FIFO depth, and data storage capability; reduced memory can constrain memory-intensive designs. |
| DSP Blocks (Variable Precision) | 1,368 | 912 | DSP blocks accelerate multiply-accumulate operations; fewer blocks reduce signal-processing throughput. |
| Package | FBGA-1152 | FBGA-672 | Package footprint and ball count determine PCB layout compatibility; different packages are not drop-in interchangeable. |
| Operating Temperature Range | 0°C to 100°C (Extended) | 0°C to 100°C (Extended) | Temperature grade affects reliability in harsh environments; mismatched grades can cause field failures. |
| Speed Grade | 2 (Fastest) | 1 (Fastest) | Speed grade determines maximum operating frequency and timing closure; a slower grade may not meet timing requirements. |
| Transceiver Count | 24 | 12 | High-speed transceivers enable serial interfaces like PCIe and Ethernet; fewer transceivers limit I/O bandwidth options. |
| Maximum User I/O | 624 | 384 | User I/O count determines how many external signals can be interfaced; fewer pins restrict peripheral connectivity. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10AX048H2F34E2SG | 10AX032E1F27E1SG |
|---|---|---|
| Supplier | - | Intel |
| Series | Arria 10 GX | Arria 10 GX |
| Part Status | Active | Discontinued at Digi-Key |
| Number of LABs/CLBs | - | 119900 |
| Number of Logic Elements/Cells | - | 320000 |
| Total RAM Bits | 5664768 | 21040128 |
| Number of I/O | 492 | 240 |
| Voltage - Supply | 0.87V ~ 0.98V | 0.87V ~ 0.98V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) | 0°C ~ 100°C (TJ) |
| Digi Key Programmable | Not Verified | - |
| Number of LA Bs / CL Bs | 183590 | - |
| Number of Logic Elements / Cells | 480000 | - |
| Packaging | Tray | - |
Frequently asked questions
What are the key differences between the Intel 10AX048H2F34E2SG and the 10AX032E1F27E1SG FPGA devices?
The 10AX048H2F34E2SG is an Intel Arria 10 GX FPGA with 480,000 logic elements, a 1150-pin FBGA package (34 mm x 34 mm), and a speed grade of 2. The 10AX032E1F27E1SG is an Arria 10 GX FPGA with 320,000 logic elements, a 672-pin FBGA package (27 mm x 27 mm), and a speed grade of 1. Both are members of the Intel Arria 10 GX family, but they differ in logic density, package size, pin count, and speed grade.
Are the 10AX048H2F34E2SG and 10AX032E1F27E1SG pin-to-pin compatible?
No. The 10AX048H2F34E2SG uses a 1150-pin FBGA package, while the 10AX032E1F27E1SG uses a 672-pin FBGA package. The different pin counts and package dimensions mean they are not pin-to-pin compatible and cannot be interchanged on the same PCB footprint without a redesign.
Can the 10AX032E1F27E1SG be used as a direct drop-in replacement for the 10AX048H2F34E2SG?
No. A direct drop-in replacement is not possible because the two devices have different package sizes, pin counts, and logic densities. The 10AX048H2F34E2SG offers 480,000 logic elements in a 1150-pin package, while the 10AX032E1F27E1SG offers 320,000 logic elements in a 672-pin package. Any substitution would require a new PCB layout and design validation.
What are the logic element counts for the 10AX048H2F34E2SG and 10AX032E1F27E1SG?
The 10AX048H2F34E2SG has 480,000 logic elements. The 10AX032E1F27E1SG has 320,000 logic elements. These values are specified in the Intel Arria 10 device family datasheets and product tables.
What speed grades are available for the 10AX048H2F34E2SG and 10AX032E1F27E1SG?
The 10AX048H2F34E2SG is specified with speed grade 2. The 10AX032E1F27E1SG is specified with speed grade 1. Speed grade affects timing performance and must be considered when evaluating whether one device can meet the timing requirements of a design intended for the other.
Do the 10AX048H2F34E2SG and 10AX032E1F27E1SG belong to the same Intel FPGA family?
Yes. Both devices are members of the Intel Arria 10 GX FPGA family. They share the same architecture and feature set at the family level, but differ in logic density, package options, and speed grade.
What package types are used by the 10AX048H2F34E2SG and 10AX032E1F27E1SG?
The 10AX048H2F34E2SG uses a 1150-pin FBGA package with a 34 mm x 34 mm body size. The 10AX032E1F27E1SG uses a 672-pin FBGA package with a 27 mm x 27 mm body size. Both are fine-pitch ball grid array packages, but their footprints and ball maps are different.
Which device should be selected for a design requiring higher logic density?
The 10AX048H2F34E2SG should be selected when higher logic density is required, as it provides 480,000 logic elements compared to 320,000 logic elements in the 10AX032E1F27E1SG. However, the larger 1150-pin package and different speed grade must also be factored into the board design and timing analysis.