Part A
10AX048H3F34E2SG
Intel
- Lifecycle
- Active
- Stock
- 6684 PCS
- Package
- FBGA-1152
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10AX048H3F34E2SG and 10AX032E2F29I2SG are both Intel Arria 10 GX series FPGAs sharing the same core architecture and transceiver technology, but they differ in logic density, package footprint, speed grade, and operating temperature range. The 10AX048H3F34E2SG offers higher logic capacity and a larger package, while the 10AX032E2F29I2SG provides a smaller footprint with lower density. Direct substitution requires careful validation of resource requirements, board layout compatibility, and thermal conditions.
Logic Density
Validation required
Package Type
Not compatible
Speed Grade
Validation required
Operating Temperature
Not compatible
Parts at a glance
Part B
10AX032E2F29I2SG
Intel
- Lifecycle
- Active
- Stock
- 9496 PCS
- Package
- BBGA-780
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10AX048H3F34E2SG | 10AX032E2F29I2SG | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 480,000 | 320,000 | Logic capacity determines how much custom digital logic can be implemented; a smaller device may not fit the same design. |
| Total RAM (Mbits) | 28.4 | 19.0 | On-chip memory affects buffering, FIFO depth, and whether a design's memory requirements can be met without external RAM. |
| Package | FBGA-1152 (F34) | FBGA-780 (F29) | Package footprint and ball count must match the PCB layout; different packages are not drop-in compatible. |
| Transceiver Count | 24 | 12 | High-speed serial transceivers are needed for protocols like PCIe, Ethernet, and JESD204; fewer channels limits interface capability. |
| Maximum Transceiver Data Rate | 17.4 Gbps | 17.4 Gbps | Determines the highest serial line rate supported; identical rates mean comparable high-speed interface performance. |
| Speed Grade | 3 (High Performance) | 2 (High Performance) | Speed grade affects maximum clock frequency and timing closure; a slower grade may not meet the same performance targets. |
| Operating Temperature Range | 0°C to 100°C (Commercial/Extended) | -40°C to 100°C (Industrial) | Temperature grade determines suitability for industrial versus commercial environments and affects reliability margins. |
| Supply Voltage (Core) | 0.9 V | 0.9 V | Core voltage must match the board's power design; identical values simplify power supply reuse. |
| I/O Count | 492 | 372 | Available I/O pins constrain peripheral and interface connections; fewer pins may force design changes. |
| Family | Arria 10 GX | Arria 10 GX | Same device family ensures toolchain, IP, and pinout compatibility at the architectural level. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10AX048H3F34E2SG | 10AX032E2F29I2SG |
|---|---|---|
| Supplier | - | Intel |
| Series | Arria 10 GX | Arria 10 GX |
| Part Status | Active | Active |
| Number of LABs/CLBs | 183590 | 119900 |
| Number of Logic Elements/Cells | 480000 | 320000 |
| Total RAM Bits | 5664768 | 21040128 |
| Number of I/O | 492 | 360 |
| Voltage - Supply | 0.87V ~ 0.93V | 0.87V ~ 0.98V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 10AX048H3F34E2SG and the 10AX032E2F29I2SG?
The 10AX048H3F34E2SG is an Intel Arria 10 GX FPGA with 480,000 logic elements in a 1152-pin FBGA package, while the 10AX032E2F29I2SG is an Arria 10 GX FPGA with 320,000 logic elements in a 780-pin FBGA package. They differ in logic density, package size, pin count, and speed grade.
Are the 10AX048H3F34E2SG and 10AX032E2F29I2SG pin-compatible?
No. The 10AX048H3F34E2SG uses a 1152-pin FBGA package, while the 10AX032E2F29I2SG uses a 780-pin FBGA package. The different pin counts and package footprints make them physically incompatible for the same PCB land pattern.
Can the 10AX032E2F29I2SG be used as a drop-in replacement for the 10AX048H3F34E2SG?
No. The two devices differ in logic element count (320,000 vs 480,000), package (780-pin vs 1152-pin FBGA), and speed grade (2 vs 3). A drop-in replacement is not possible without redesigning the PCB and revalidating the logic design.
What speed grades do the 10AX048H3F34E2SG and 10AX032E2F29I2SG use?
The 10AX048H3F34E2SG uses speed grade 3, while the 10AX032E2F29I2SG uses speed grade 2. Speed grade affects timing performance and must be considered when migrating a design between these devices.
Do both the 10AX048H3F34E2SG and 10AX032E2F29I2SG belong to the same FPGA family?
Yes. Both devices are members of the Intel Arria 10 GX FPGA family, which means they share the same architecture, IP support, and development tools, though they differ in density, package, and speed grade.
What are the operating temperature ranges for the 10AX048H3F34E2SG and 10AX032E2F29I2SG?
Both the 10AX048H3F34E2SG and 10AX032E2F29I2SG are specified for industrial temperature range operation, typically -40°C to 100°C junction temperature, as defined in the Intel Arria 10 device datasheet.
Which device has higher logic capacity, the 10AX048H3F34E2SG or the 10AX032E2F29I2SG?
The 10AX048H3F34E2SG has higher logic capacity with 480,000 logic elements, compared to 320,000 logic elements in the 10AX032E2F29I2SG.
Are the 10AX048H3F34E2SG and 10AX032E2F29I2SG supported by the same Intel development tools?
Yes. Both devices are supported by Intel Quartus Prime software, including the Pro and Standard editions, as they belong to the Arria 10 GX family. However, device-specific pin assignments and timing constraints must be updated when migrating between them.