10M04DCF256C8G
Intel
- Lifecycle
- Active
- Stock
- 3218 PCS
- Package
- LBGA-256
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Esta comparação detalhada entre 10M04DCF256C8G e 10M04DAF256C7G fornece informações valiosas sobre suas especificações e principais características. Abordamos fatores importantes em detalhes, incluindo conformidade com RoHS, status REACH, série, estilo de montagem, tipo de encapsulamento e outras características relevantes. Apresentar as diferenças lado a lado simplifica a seleção de componentes, facilitando a escolha da melhor opção para sua aplicação específica.
Replacement verdict
The 10M04DAF256C7G is a viable functional replacement candidate for the 10M04DCF256C8G, sharing the same logic density, package footprint, and supply voltage profile. The primary distinction is the speed grade, which requires validation against the target design's timing margins before committing to a drop-in substitution.
Intel
Intel
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M04DCF256C8G | 10M04DAF256C7G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Same device family ensures similar architecture, toolchain support, and IP compatibility for drop-in evaluation. |
| Logic Elements (LEs) | 4,000 | 4,000 | Equal logic capacity means both can implement the same design complexity without resource overflow. |
| Embedded Memory | 189 Kbits | 189 Kbits | Identical on-chip memory supports the same buffering, FIFO, and data storage requirements. |
| Package | 256-pin FBGA | 256-pin FBGA | Same package and pin count allow the same PCB footprint and routing to be reused. |
| Operating Temperature Range | 0°C to +85°C (Commercial) | 0°C to +85°C (Commercial) | Matching temperature grades ensure both parts are suitable for the same thermal environment. |
| Speed Grade | 8 (Fastest) | 7 (Faster) | Different speed grades affect maximum operating frequency and timing closure; a faster grade may be required for high-speed designs. |
| Core Supply Voltage | 1.2 V | 1.2 V | Same core voltage means identical power supply design and decoupling requirements. |
| Configuration Method | Instant-on (single-chip) | Instant-on (single-chip) | Both support non-volatile instant-on configuration, critical for power-up timing and system initialization. |
| RoHS Compliance | Yes | Yes | Both meet RoHS, ensuring regulatory compliance for commercial and industrial products. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M04DCF256C8G | 10M04DAF256C7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 250 | 250 |
| Number of Logic Elements/Cells | 4000 | 4000 |
| Total RAM Bits | 193536 | 193536 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Both are Intel (formerly Altera) MAX 10 family field-programmable gate arrays (FPGAs) in a 256-ball FineLine BGA (FBGA) package. The 10M04DCF256C8G is specified with a commercial temperature grade and speed grade 8, while the 10M04DAF256C7G is specified with an automotive temperature grade and speed grade 7.
Both devices provide 4,000 logic elements (LEs), which is the defining density of the 10M04 product line within the MAX 10 FPGA family.
The 10M04DCF256C8G uses speed grade 8, while the 10M04DAF256C7G uses speed grade 7. In Intel MAX 10 ordering codes, a lower speed grade number indicates a faster device, so the 10M04DAF256C7G is the faster of the two.
The 10M04DCF256C8G is a commercial-grade device, while the 10M04DAF256C7G is an automotive-grade device. The automotive grade supports a wider operating temperature range suitable for automotive and harsh-environment applications.
Both devices are offered in the same 256-ball FBGA package with the same MAX 10 device pinout for the 10M04 density. However, designers must confirm pinout, configuration, and thermal requirements against the official Intel MAX 10 device pin-out files and datasheet before treating them as drop-in replacements.
They share the same logic density and package, but differ in speed grade and temperature grade. Interchangeability depends on whether the target design meets timing at speed grade 8 and whether the commercial temperature range is acceptable. The automotive-grade 10M04DAF256C7G may be used where a wider temperature range or faster timing is required, subject to design validation.
MAX 10 FPGAs support dual configuration images and integrated flash memory, allowing instant-on and dual-boot operation. Both the 10M04DCF256C8G and 10M04DAF256C7G include these MAX 10 configuration features as documented in the Intel MAX 10 FPGA device datasheet.
The 10M04DAF256C7G is the automotive-grade option and is the appropriate choice for automotive designs that require an extended temperature range and faster speed grade. The 10M04DCF256C8G is intended for commercial-grade applications.