10M08DAF256C8G
Intel
- Lifecycle
- Active
- Stock
- 3270 PCS
- Package
- LBGA-256
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Esta comparação detalhada entre 10M08DAF256C8G e 10M08DCF256C7G fornece informações valiosas sobre suas especificações e principais características. Abordamos fatores importantes em detalhes, incluindo conformidade com RoHS, status REACH, série, estilo de montagem, tipo de encapsulamento e outras características relevantes. Apresentar as diferenças lado a lado simplifica a seleção de componentes, facilitando a escolha da melhor opção para sua aplicação específica.
Replacement verdict
The 10M08DAF256C8G and 10M08DCF256C7G are both Intel MAX 10 FPGA devices sharing the same 10M08 density, 256-ball FineLine BGA package, and dual-supply architecture, making them functionally interchangeable in most designs. The primary distinction lies in speed grade and operating temperature range, which may affect timing closure and thermal margins in demanding applications. Designers should validate timing performance and confirm the target operating environment before committing to a direct substitution.
Intel
Intel
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M08DAF256C8G | 10M08DCF256C7G | Why it matters |
|---|---|---|---|
| Family | MAX 10 | MAX 10 | Both devices belong to the same MAX 10 FPGA family, which is the baseline requirement for functional substitutability. |
| Logic Elements (LEs) | 8,000 | 8,000 | Identical logic capacity ensures the same design fits without resource overflow when swapping parts. |
| Embedded Memory | 378 Kbits | 378 Kbits | Matching on-chip memory supports the same buffering, FIFO, and ROM requirements across both devices. |
| Package | 256-pin FBGA | 256-pin FBGA | Same package and pin count allow a drop-in board-level replacement without PCB redesign. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | 0°C to 85°C (Commercial) | Equivalent temperature grades mean both parts suit the same thermal environment and application conditions. |
| Speed Grade | 8 (Fastest) | 7 (Fast) | A faster speed grade provides more timing margin, so a design closed on grade 7 will also meet timing on grade 8, but not necessarily vice versa. |
| Core Supply Voltage | 1.2 V | 1.2 V | Identical core voltage means the same power supply design and decoupling network can be reused. |
| Configuration Method | Instant-on (single/dual configuration image) | Instant-on (single/dual configuration image) | Same configuration scheme ensures the existing configuration flash and boot sequence remain compatible. |
| Analog-to-Digital Converter (ADC) | Yes (integrated 12-bit ADC) | Yes (integrated 12-bit ADC) | Both include the same integrated ADC block, preserving analog monitoring and sensing functionality. |
| RoHS Compliance | RoHS Compliant | RoHS Compliant | Both meet the same environmental regulations, so no compliance re-qualification is needed for the swap. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M08DAF256C8G | 10M08DCF256C7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Obsolete |
| Number of LABs/CLBs | 500 | 500 |
| Number of Logic Elements/Cells | 8000 | 8000 |
| Total RAM Bits | 387072 | 387072 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Both devices are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in the same 256-pin FineLine BGA (FBGA) package with 8,000 logic elements (LEs). The primary differences are the speed grade and the integrated feature set: the 10M08DAF256C8G is a dual-supply, non-volatile MAX 10 device with an 8 speed grade, while the 10M08DCF256C7G is a single-supply, non-volatile MAX 10 device with a 7 speed grade. The "DA" and "DC" suffixes indicate different feature options within the MAX 10 family, including differences in analog-to-digital converter (ADC) capability and flash memory configuration. Designers must consult the respective datasheets to confirm exact feature availability.
Both devices use the same 256-pin FBGA package (256-ball FineLine BGA, 17 x 17 mm). However, pin compatibility depends on the specific I/O standards, dedicated pins, and feature usage defined in the Intel MAX 10 device pin-out files. Because the "DA" and "DC" feature sets differ, some pins may have different functions or restrictions. A direct drop-in replacement should only be attempted after verifying the pin-out files and design constraints against the official Intel MAX 10 pin-out documentation.
The 10M08DAF256C8G has a speed grade of 8, while the 10M08DCF256C7G has a speed grade of 7. In Intel FPGA nomenclature, a lower number indicates a faster speed grade. Therefore, the 10M08DCF256C7G (speed grade 7) offers faster maximum operating frequencies and tighter timing performance than the 10M08DAF256C8G (speed grade 8). The exact timing differences are specified in the Intel MAX 10 device datasheet.
Both the 10M08DAF256C8G and 10M08DCF256C7G are MAX 10 non-volatile FPGAs and support configuration from internal flash memory, as well as external configuration via JTAG and other supported modes. However, the specific configuration features and available configuration schemes may vary between the "DA" and "DC" variants. Designers should refer to the Intel MAX 10 General Purpose I/O User Guide and the respective device datasheets for the exact configuration options supported by each part number.
A direct substitution is not recommended without thorough validation. Although both are 8,000-LE MAX 10 FPGAs in the same 256-pin FBGA package, they differ in speed grade (8 vs. 7) and feature set ("DA" vs. "DC"). These differences can affect timing closure, power consumption, I/O capabilities, and available hard IP blocks. The replacement must be verified against the target design's timing requirements, pin assignments, and feature usage using Intel's official documentation and Quartus Prime software.
Both the 10M08DAF256C8G and 10M08DCF256C7G are specified with a commercial temperature grade, indicated by the "C" in the part number. The commercial temperature range for Intel MAX 10 devices is typically 0°C to 85°C junction temperature (TJ). For exact thermal specifications and operating conditions, refer to the Intel MAX 10 device datasheet.
The MAX 10 family includes devices with and without an integrated ADC. The "DA" and "DC" feature designations correspond to different configurations of the MAX 10 feature set, which may include the presence or absence of the ADC block. To determine whether the 10M08DAF256C8G and 10M08DCF256C7G include the ADC, consult the Intel MAX 10 device overview and the specific device datasheet, as this cannot be assumed from the part number alone without verification.
Both devices are suitable for general-purpose FPGA applications requiring 8,000 logic elements in a compact 256-pin FBGA package, such as industrial control, motor control, communication interfaces, and system management. The 10M08DCF256C7G, with its faster speed grade 7, may be preferred for designs with tighter timing requirements, while the 10M08DAF256C8G may be used where speed grade 8 timing is sufficient. Final selection should be based on the specific design's timing, power, and feature requirements as documented by Intel.