10M16DAU324C8G vs 10M16DAU324I6G

Esta comparação detalhada entre 10M16DAU324C8G e 10M16DAU324I6G fornece informações valiosas sobre suas especificações e principais características. Abordamos fatores importantes em detalhes, incluindo conformidade com RoHS, status REACH, série, estilo de montagem, tipo de encapsulamento e outras características relevantes. Apresentar as diferenças lado a lado simplifica a seleção de componentes, facilitando a escolha da melhor opção para sua aplicação específica.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The 10M16DAU324I6G is a functionally compatible alternative to the 10M16DAU324C8G, sharing the same Intel MAX 10 FPGA family, 16,000 logic elements, 324-pin FBGA package, and core architecture. The primary distinction is the operating temperature grade, with the industrial-grade I6G supporting a wider temperature range than the commercial-grade C8G. Designers should validate thermal margins and timing closure under the target operating conditions before committing to a drop-in substitution.

Logic Density High match
Package Type High match
Operating Temperature Validation required
Supply Voltage High match

Parts at a glance

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 10M16DAU324C8G 10M16DAU324I6G Why it matters
Operating Temperature Range 0°C to 85°C (Commercial) -40°C to 100°C (Industrial) Determines the environments in which the device can reliably operate; industrial-grade parts support harsher conditions.
Speed Grade 8 6 A lower speed grade number indicates faster maximum operating frequency and tighter timing performance.
Logic Elements (LEs) 16000 16000 Defines the available programmable logic capacity for implementing user designs.
Package 324-pin FBGA 324-pin FBGA Must match the PCB footprint for physical interchangeability.
Family / Series MAX 10 MAX 10 Confirms both devices belong to the same FPGA family with compatible architecture and toolchain.
Supply Voltage 1.2 V core 1.2 V core Core voltage must match the board power design for correct operation.
Configuration Memory Integrated flash Integrated flash On-chip configuration flash enables instant-on operation without external configuration devices.
RoHS Compliance RoHS compliant RoHS compliant Ensures the part meets environmental regulations for lead-free manufacturing.

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 10M16DAU324C8G 10M16DAU324I6G
Supplier - Intel
Series MAX® 10 MAX® 10
Part Status Active Active
Number of LABs/CLBs 1000 1000
Number of Logic Elements/Cells 16000 16000
Total RAM Bits 562176 562176
Number of I/O 246 246
Voltage - Supply 1.15V ~ 1.25V 1.15V ~ 1.25V
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ)

Frequently asked questions

What are the 10M16DAU324C8G and 10M16DAU324I6G devices?

Both are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in the same 324-pin FineLine BGA (FBGA) package. They share the same logic density of 16,000 logic elements (LEs), the same 324-pin package, and the same dual-configuration flash architecture. The suffix difference is the speed grade and temperature grade: C8G denotes commercial temperature range with speed grade 8, while I6G denotes industrial temperature range with speed grade 6.

What is the difference between the C8G and I6G suffixes on these MAX 10 FPGAs?

The "C" in 10M16DAU324C8G indicates the commercial temperature grade (typically 0°C to 85°C junction temperature), and "8" indicates speed grade 8. The "I" in 10M16DAU324I6G indicates the industrial temperature grade (typically -40°C to 100°C junction temperature), and "6" indicates speed grade 6. Speed grade 6 is faster than speed grade 8, meaning the I6G device supports higher maximum operating frequencies for the same logic paths.

Are the 10M16DAU324C8G and 10M16DAU324I6G pin-compatible?

Yes. Both devices use the same 324-pin FBGA package with the same pinout and footprint. They are pin-to-pin compatible, so a board designed for one can physically accept the other. However, electrical and timing differences between speed grades and temperature grades must be validated before substitution.

Can the 10M16DAU324C8G be replaced by the 10M16DAU324I6G in an existing design?

Physical replacement is possible because both are 324-pin FBGA devices with identical pinouts. However, the I6G is an industrial-temperature, faster speed-grade device. The design's timing closure, power budget, and thermal management must be re-verified. The I6G may consume different power and may require different external component ratings for industrial temperature operation. Always confirm against the Intel MAX 10 device datasheet and your board-level requirements.

Which device is better for industrial-temperature applications?

The 10M16DAU324I6G is specified for the industrial temperature range and is therefore the appropriate choice for industrial-temperature environments. The 10M16DAU324C8G is specified for the commercial temperature range and is not rated for the same extended temperature conditions. Selection should be based on the actual operating temperature range required by the application.

Do both devices have the same logic density and memory resources?

Yes. Both are MAX 10 10M16 devices, which provide 16,000 logic elements (LEs). They share the same embedded memory capacity, embedded multiplier configuration, and dual-configuration flash features as defined by the Intel MAX 10 device family. The primary differences are speed grade and temperature grade, not logic or memory density.

What configuration options do these MAX 10 devices support?

Both 10M16DAU324C8G and 10M16DAU324I6G are MAX 10 FPGAs featuring dual-configuration flash, which allows two configuration images to be stored on-chip. They support instant-on configuration and can be configured via JTAG, internal flash, or external configuration sources as defined in the Intel MAX 10 documentation. Configuration details are identical for both devices because they share the same die and package family.

Which speed grade offers higher performance, C8G or I6G?

The I6G device has speed grade 6, which is faster than the C8G device's speed grade 8. In Intel FPGA nomenclature, a lower speed grade number indicates a faster device. Therefore, the 10M16DAU324I6G supports higher maximum operating frequencies and tighter timing margins than the 10M16DAU324C8G, assuming both are operated within their respective temperature ranges.