Part A
10M16DCF484C8G
Intel
- Lifecycle
- Active
- Stock
- 6504 PCS
- Package
- BGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M16DCF484C8G and 10M16DAF484C7G are both Intel (Altera) MAX 10 FPGA devices sharing the same 16,000 logic element density and 484-ball FineLine BGA package, making them functionally interchangeable in most designs. The primary distinction is speed grade and temperature range, which may require timing re-validation depending on the target application.
Logic Density
High match
Package Type
High match
Speed Grade
Validation required
Operating Temperature
Validation required
Parts at a glance
Part B
10M16DAF484C7G
Intel
- Lifecycle
- Active
- Stock
- 6583 PCS
- Package
- BGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16DCF484C8G | 10M16DAF484C7G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both devices belong to the same Intel MAX 10 FPGA family, which is the baseline requirement for functional substitutability. |
| Logic Elements (LEs) | 16,000 | 16,000 | Matching logic density ensures the same design fits without resource overflow when swapping parts. |
| Package / Pin Count | 484-pin FBGA | 484-pin FBGA | Identical package and pin count allow the same PCB footprint and pinout to be reused. |
| Speed Grade | 8 (fastest) | 7 (faster) | Speed grade affects maximum operating frequency and timing closure; a slower grade may not meet the same timing constraints. |
| Operating Temperature Range | Commercial (0°C to 85°C) | Automotive (-40°C to 125°C) | Temperature grade determines the environments in which the device can reliably operate; automotive grade supports harsher conditions. |
| On-Chip Flash (Configuration) | Yes (dual configuration) | Yes (single configuration) | Dual configuration flash allows two images to be stored for fail-safe or field upgrade scenarios, while single configuration stores only one. |
| Analog-to-Digital Converter (ADC) | Yes | Yes | Both include the integrated ADC block, so analog monitoring features remain available after substitution. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Matching core voltage means the same power supply design and decoupling network can be used. |
| Configuration Method | Internal flash / JTAG | Internal flash / JTAG | Same configuration options ensure the existing programming flow and tools remain compatible. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M16DCF484C8G | 10M16DAF484C7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1000 | 1000 |
| Number of Logic Elements/Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 320 | 320 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 10M16DCF484C8G and the 10M16DAF484C7G?
The primary differences are the operating temperature grade and the speed grade. The 10M16DCF484C8G is specified for commercial temperature range (0°C to 85°C junction) with speed grade 8, while the 10M16DAF484C7G is specified for industrial temperature range (-40°C to 100°C junction) with speed grade 7. Both are Intel (Altera) MAX 10 field-programmable gate arrays (FPGAs) in the same 484-pin FineLine BGA (FBGA) package with 16,000 logic elements (LEs).
Are the 10M16DCF484C8G and 10M16DAF484C7G pin-to-pin compatible?
Yes. Both devices are offered in the same 484-pin FineLine BGA (FBGA) package with identical pinouts as defined by the Intel MAX 10 device pin-out files. The package designation "F484" indicates the same physical footprint and ball assignment, so they are pin-to-pin compatible when the PCB land pattern and thermal requirements are met.
Can the 10M16DCF484C8G be used as a direct drop-in replacement for the 10M16DAF484C7G?
Not unconditionally. Although both are pin-compatible 16,000-LE MAX 10 FPGAs in the same F484 package, the 10M16DAF484C7G is an industrial-temperature, faster speed-grade (7) device, while the 10M16DCF484C8G is a commercial-temperature, slower speed-grade (8) device. A drop-in replacement is only valid if the target design's timing margins, power budget, and thermal environment are re-verified against the commercial temperature range and speed grade 8 characteristics.
What is the logic density of the 10M16DCF484C8G and 10M16DAF484C7G?
Both devices provide 16,000 logic elements (LEs), which is the defining characteristic of the MAX 10 10M16 family. They also share the same embedded memory, multiplier, and PLL resources as documented in the Intel MAX 10 device family datasheet.
What temperature grades do the 10M16DCF484C8G and 10M16DAF484C7G support?
The 10M16DCF484C8G supports the commercial temperature grade, typically specified as 0°C to 85°C junction temperature (TJ). The 10M16DAF484C7G supports the industrial temperature grade, typically specified as -40°C to 100°C junction temperature (TJ). These ratings are defined in the Intel MAX 10 device datasheet and must be observed for reliable operation.
What does the speed grade suffix indicate for these two MAX 10 devices?
The speed grade is encoded in the part number: the 10M16DCF484C8G has speed grade 8, and the 10M16DAF484C7G has speed grade 7. In Intel FPGA nomenclature, a lower speed grade number indicates a faster device with shorter propagation delays and higher maximum operating frequencies. Therefore, the 10M16DAF484C7G offers faster timing performance than the 10M16DCF484C8G.
Do the 10M16DCF484C8G and 10M16DAF484C7G support the same configuration and packaging options?
Both devices are offered in the 484-pin FineLine BGA (FBGA) package and support the same MAX 10 configuration schemes, including internal configuration flash, JTAG, and external configuration via supported interfaces. Specific configuration details, such as the number of user I/O pins and dedicated configuration pins, are identical for both devices because they share the same die and package.
Which device should be selected for an industrial application with wide temperature swings?
The 10M16DAF484C7G should be selected for industrial applications requiring operation over -40°C to 100°C junction temperature. The 10M16DCF484C8G is rated only for commercial temperatures (0°C to 85°C TJ) and is not qualified for industrial temperature operation. Using the commercial-grade device outside its rated temperature range may result in unreliable operation and is not supported by the manufacturer.
Are the 10M16DCF484C8G and 10M16DAF484C7G RoHS compliant?
Both devices are offered in RoHS-compliant packages as indicated by Intel's product material declarations and distributor part data. The "G" suffix in both part numbers denotes lead-free (Pb-free) RoHS-compliant packaging. Designers should confirm the latest compliance documentation from Intel or authorized distributors for the specific ordering code.