Part A
10M16DCU324C8G
Altera
- Lifecycle
- Active
- Stock
- 5166 PCS
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M16DCU324I6G is a functionally compatible replacement candidate for the 10M16DCU324C8G, sharing the same Intel MAX 10 FPGA family, 16,000 logic elements, 324-ball UBGA package, and core architecture. The primary distinction is the operating temperature grade, with the industrial-grade I6G offering a wider temperature range than the commercial-grade C8G. Designers should validate thermal margins and timing closure under the target operating conditions before committing to a drop-in substitution.
Logic Density
High match
Package Type
High match
Operating Temperature
Validation required
Supply Voltage
High match
Parts at a glance
Part B
10M16DCU324I6G
Intel
- Lifecycle
- Active
- Stock
- 3807 PCS
- Package
- LFBGA-324
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16DCU324C8G | 10M16DCU324I6G | Why it matters |
|---|---|---|---|
| Operating Temperature Range | 0°C to 85°C (Commercial) | -40°C to 100°C (Industrial) | Determines the environments in which the device can reliably operate; industrial grade supports harsher conditions than commercial grade. |
| Speed Grade | 8 | 6 | A lower speed grade number indicates faster maximum operating frequency and tighter timing performance, affecting achievable clock rates and timing closure. |
| Logic Elements (LEs) | 16000 | 16000 | Defines the available programmable logic capacity for implementing user designs; identical capacity means equivalent logic density. |
| Package | 324-pin UBGA | 324-pin UBGA | Package type and pin count determine PCB footprint, assembly compatibility, and available I/O; matching packages allow drop-in board compatibility. |
| Family / Series | MAX 10 | MAX 10 | Confirms both devices belong to the same FPGA family, ensuring similar architecture, tool support, and feature set. |
| Embedded Memory | 549 kbits | 549 kbits | On-chip memory capacity affects ability to store data, buffers, and look-up tables within the FPGA without external memory. |
| Number of I/O Pins | 246 | 246 | Determines how many external signals the device can interface with; identical I/O count supports equivalent peripheral connectivity. |
| Supply Voltage | 1.2 V core | 1.2 V core | Core voltage must match the board power design; identical values ensure the same power delivery scheme can be used. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M16DCU324C8G | 10M16DCU324I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | - | 1000 |
| Number of Logic Elements/Cells | - | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 246 | 246 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
| Digi Key Programmable | Not Verified | - |
| Number of LA Bs / CL Bs | 1000 | - |
| Number of Logic Elements / Cells | 16000 | - |
| Packaging | Tray | - |
Frequently asked questions
What are the 10M16DCU324C8G and 10M16DCU324I6G devices?
Both are Intel (formerly Altera) MAX 10 family field-programmable gate arrays (FPGAs) in the same 324-pin UBGA package with 16,000 logic elements (LEs). The 10M16DCU324C8G is specified for commercial temperature operation, while the 10M16DCU324I6G is specified for industrial temperature operation.
What is the difference between the C8 and I6 speed and temperature grades?
The suffix "C8" denotes a commercial-grade device with a speed grade of 8, and "I6" denotes an industrial-grade device with a speed grade of 6. The industrial version supports a wider operating temperature range, while the speed grade indicates relative timing performance as defined in Intel MAX 10 documentation.
Are the 10M16DCU324C8G and 10M16DCU324I6G pin-compatible?
Yes. Both devices use the same 324-pin UBGA package and the same MAX 10 10M16 device die configuration, so the pinout and package footprint are identical. Designers must still verify all electrical and timing requirements for the target application.
Can the 10M16DCU324C8G be used as a drop-in replacement for the 10M16DCU324I6G?
Not unconditionally. Although the package and pinout match, the industrial-grade 10M16DCU324I6G supports a wider temperature range and a different speed grade than the commercial-grade 10M16DCU324C8G. A replacement is valid only after confirming that the target design's timing, temperature, and power requirements are satisfied by the substitute device.
What logic capacity do the 10M16DCU324C8G and 10M16DCU324I6G provide?
Both devices provide 16,000 logic elements (LEs) as part of the Intel MAX 10 10M16 density offering. They also include embedded memory blocks, user flash memory, and DSP blocks consistent with the MAX 10 device family specifications.
Which device should be selected for an industrial-temperature application?
The 10M16DCU324I6G should be selected for industrial-temperature applications because its "I" grade denotes industrial temperature support. The 10M16DCU324C8G is intended for commercial-temperature environments and should not be assumed to meet industrial thermal requirements.
Do both devices support the same configuration and flash features?
Yes. Both are MAX 10 devices with integrated configuration flash, so they support the same MAX 10 configuration schemes, including internal configuration from user flash memory and dual configuration images, as documented by Intel for the MAX 10 family.