Part A
10M16SAU169I7G
Intel
- Lifecycle
- Active
- Stock
- 6216 PCS
- Package
- BGA-169
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M16SAU169I7G and 10M16DCF484A7G are both Intel MAX 10 FPGA devices sharing 16,000 logic elements and comparable core architecture, making them functionally related candidates. However, they differ in package type, I/O pin count, and operating temperature grade, so a direct drop-in substitution is not possible without design and layout validation. The 10M16SAU169I7G offers a higher I/O count in a UBGA-169 package with industrial temperature rating, while the 10M16DCF484A7G provides fewer I/Os in a TFBGA-484 package with commercial temperature rating. Engineers must verify pinout compatibility, thermal requirements, and board-level constraints before considering either device as a replacement for the other.
Package Type
Validation required
I/O Pin Count
Validation required
Operating Temperature
Validation required
Logic Element Count
High match
Parts at a glance
Part B
10M16DCF484A7G
Intel
- Lifecycle
- Active
- Stock
- 4360 PCS
- Package
- BGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16SAU169I7G | 10M16DCF484A7G | Why it matters |
|---|---|---|---|
| Family | MAX 10 | MAX 10 | Both devices belong to the same FPGA family, which supports similar design toolchains and IP reuse. |
| Logic Elements (LEs) | 16000 | 16000 | Matching logic capacity ensures equivalent logic density for the target design. |
| Package | 169-UBGA (11x11) | 484-FBGA (23x23) | Different package footprints and pin counts affect PCB layout, routing, and mechanical compatibility. |
| Number of I/Os | 130 | 320 | I/O count determines how many external signals the device can interface with, impacting system connectivity. |
| Operating Temperature Range | -40°C to 100°C (Industrial) | 0°C to 85°C (Commercial) | Temperature grade affects reliability and suitability for harsh or industrial environments. |
| Speed Grade | 7 | 7 | Speed grade influences maximum operating frequency and timing closure for the design. |
| Embedded Memory (M9K blocks) | 549 kbits | 549 kbits | On-chip memory capacity affects the ability to store data, buffers, or implement soft processors. |
| Configuration Flash | Yes (Instant-on) | Yes (Instant-on) | Integrated configuration flash enables single-chip operation and faster power-up without external memory. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Core voltage must match the board power design for correct operation and power budgeting. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M16SAU169I7G | 10M16DCF484A7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1000 | 1000 |
| Number of Logic Elements/Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 130 | 320 |
| Voltage - Supply | 2.85V ~ 3.465V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 125°C (TJ) |
Frequently asked questions
What are the key differences between the 10M16SAU169I7G and the 10M16DCF484A7G?
The 10M16SAU169I7G is a MAX 10 FPGA in a 169-pin UBGA package with commercial temperature grade (0°C to 85°C junction) and speed grade 7. The 10M16DCF484A7G is a MAX 10 FPGA in a 484-pin FBGA package with commercial temperature grade and speed grade 7. Both devices feature 16,000 logic elements (LEs), but differ in package type, pin count, and available user I/O.
Do the 10M16SAU169I7G and 10M16DCF484A7G have the same logic density?
Yes. Both devices are members of the Intel MAX 10 FPGA family with 16,000 logic elements (LEs), 549 Kbits of M9K memory, and 32 embedded 18x18 multipliers, as specified in the Intel MAX 10 device datasheet.
Are the 10M16SAU169I7G and 10M16DCF484A7G pin-to-pin compatible?
No. The 10M16SAU169I7G uses a 169-pin UBGA package, while the 10M16DCF484A7G uses a 484-pin FBGA package. They have different physical dimensions, ball counts, and ball maps, so they are not drop-in replacements for each other.
Can the 10M16SAU169I7G be used as a substitute for the 10M16DCF484A7G in an existing design?
Not directly. Although both share the same 16,000 LE MAX 10 architecture, the different package footprint, pin count, and I/O availability require a complete PCB redesign and pin assignment revalidation. Substitution is only possible after verifying all electrical and functional requirements against the respective Intel datasheets.
What temperature grade do the 10M16SAU169I7G and 10M16DCF484A7G support?
Both devices are specified with the commercial temperature grade, supporting a junction temperature range of 0°C to 85°C, as defined in the Intel MAX 10 FPGA device datasheet.
Do both devices support instant-on configuration and integrated flash?
Yes. Both the 10M16SAU169I7G and 10M16DCF484A7G are MAX 10 FPGAs featuring integrated flash memory for instant-on configuration, dual configuration image support, and analog-to-digital converter (ADC) blocks, per the Intel MAX 10 family specifications.
How many user I/O pins are available on each device?
The 10M16SAU169I7G in the 169-pin UBGA package provides up to 130 user I/O pins. The 10M16DCF484A7G in the 484-pin FBGA package provides up to 360 user I/O pins. Exact I/O counts depend on the selected device density and package combination as listed in the Intel MAX 10 pin-out files.
Are both devices RoHS compliant and lead-free?
Yes. Both the 10M16SAU169I7G and 10M16DCF484A7G are offered in RoHS-compliant, lead-free packages as stated in Intel product material declarations and distributor environmental documentation.