Part A
10M25DCF484C8G
Intel
- Lifecycle
- Active
- Stock
- 3416 PCS
- Package
- BGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M25DCF484C8G and 10M25DAF484I6G are both Intel MAX 10 FPGA devices sharing the same 25,000 logic element density and 484-ball FineLine BGA footprint, making them functionally interchangeable at the board level. However, they differ in operating temperature grade and speed grade, so the 10M25DAF484I6G should be validated against the target application's thermal and timing requirements before being used as a direct substitute for the 10M25DCF484C8G.
Logic Density
High match
Package Type
High match
Operating Temperature
Validation required
Speed Grade
Validation required
Parts at a glance
Part B
10M25DAF484I6G
Intel
- Lifecycle
- Active
- Stock
- 4109 PCS
- Package
- BGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M25DCF484C8G | 10M25DAF484I6G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both devices belong to the same Intel MAX 10 FPGA family, so they share the same architecture and toolchain support. |
| Logic Elements (LEs) | 25,000 | 25,000 | Identical logic density means both parts can implement the same logic designs without resource changes. |
| Package | 484-pin FBGA | 484-pin FBGA | Same package and pin count allow a common PCB footprint, enabling drop-in replacement at the board level. |
| Operating Temperature Range | Commercial (0°C to 85°C) | Industrial (-40°C to 100°C) | The industrial-rated part supports harsher environments, so it is not functionally interchangeable with the commercial part in temperature-sensitive applications. |
| Speed Grade | 8 (fastest) | 6 (slower) | Different speed grades affect maximum operating frequency and timing closure, so timing-critical designs may not be directly substitutable. |
| Configuration Flash Memory | Dual configuration (CF) | Single configuration (AF) | Dual-configuration devices support two images for fail-safe or field-upgrade scenarios, while single-configuration parts do not, affecting boot flexibility. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Matching core voltage ensures the same power delivery design can be reused across both parts. |
| I/O Standards Support | LVCMOS, LVTTL, SSTL, HSTL, LVDS, etc. | LVCMOS, LVTTL, SSTL, HSTL, LVDS, etc. | Identical I/O standard support means both devices can interface with the same peripheral components without level shifting changes. |
| Embedded Memory | M9K blocks (approx. 1,152 Kb) | M9K blocks (approx. 1,152 Kb) | Equal embedded memory capacity allows the same buffering, FIFO, and data storage functions to be implemented on either device. |
| DSP Blocks | Yes (embedded multipliers) | Yes (embedded multipliers) | Both include DSP blocks, so arithmetic-intensive functions can be mapped identically without architectural changes. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M25DCF484C8G | 10M25DAF484I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1563 | 1563 |
| Number of Logic Elements/Cells | 25000 | 25000 |
| Total RAM Bits | 691200 | 691200 |
| Number of I/O | 360 | 360 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 10M25DCF484C8G and the 10M25DAF484I6G?
The primary differences are the operating temperature grade and the package option. The 10M25DCF484C8G is a commercial-grade device (0°C to 85°C junction temperature) in a 484-pin FineLine BGA (FBGA) package, while the 10M25DAF484I6G is an industrial-grade device (-40°C to 100°C junction temperature) in a 484-pin FineLine BGA (FBGA) package. Both are based on the Intel (formerly Altera) MAX 10 10M25 device family with 25,000 logic elements.
Are the 10M25DCF484C8G and 10M25DAF484I6G pin-to-pin compatible?
Yes, both devices use the same 484-pin FineLine BGA (FBGA) package with identical pinouts as defined by the MAX 10 device family. However, direct substitution requires verifying that the industrial temperature grade of the 10M25DAF484I6G is acceptable for the target application and that all timing and power specifications are met under the intended operating conditions.
What is the logic density of the 10M25DCF484C8G and 10M25DAF484I6G?
Both devices feature 25,000 logic elements (LEs) as part of the Intel MAX 10 10M25 device family. They also include 1,440 Kbits of M9K embedded memory, 288 Kbits of user flash memory (UFM), and 360 18x18 multipliers. These parameters are identical for both part numbers.
Can the 10M25DCF484C8G be used in an industrial temperature application?
No. The 10M25DCF484C8G is rated for commercial temperature operation with a junction temperature range of 0°C to 85°C. For industrial temperature applications requiring -40°C to 100°C junction temperature, the 10M25DAF484I6G must be used instead. Using the commercial-grade device outside its specified temperature range is not recommended and may violate manufacturer specifications.
What configuration options are available for the 10M25DCF484C8G and 10M25DAF484I6G?
Both devices support dual configuration images and are available with either single or dual supply voltage options. The 10M25DCF484C8G and 10M25DAF484I6G both support instant-on configuration from internal flash memory, as well as external configuration via JTAG, active serial, and passive serial modes. The configuration flash memory is integrated into the device, eliminating the need for an external configuration device.
What are the speed grades of the 10M25DCF484C8G and 10M25DAF484I6G?
The 10M25DCF484C8G has a speed grade of 8, while the 10M25DAF484I6G has a speed grade of 6. A lower speed grade number indicates faster performance. Therefore, the 10M25DAF484I6G (speed grade 6) offers faster maximum operating frequencies and shorter propagation delays compared to the 10M25DCF484C8G (speed grade 8). Designers must account for this difference when migrating between the two devices.
Do the 10M25DCF484C8G and 10M25DAF484I6G support the same I/O standards?
Yes, both devices support the same I/O standards as part of the MAX 10 family, including LVTTL, LVCMOS, SSTL, HSTL, LVDS, and others. The available I/O standards are determined by the device family and package, not by the temperature grade or speed grade. Both devices offer up to 360 user I/O pins in the 484-pin FBGA package.
What are the power supply requirements for the 10M25DCF484C8G and 10M25DAF484I6G?
Both devices require a 3.3V, 2.5V, or 1.8V supply for I/O banks and a 1.2V core supply (VCCINT) for the FPGA fabric. The 10M25DCF484C8G and 10M25DAF484I6G also require a 2.5V or 3.3V supply for the configuration flash (VCCIO). Exact power sequencing and decoupling requirements are specified in the Intel MAX 10 device datasheet and must be followed for both devices.
Are the 10M25DCF484C8G and 10M25DAF484I6G RoHS compliant?
Yes, both the 10M25DCF484C8G and 10M25DAF484I6G are RoHS-compliant and lead-free, as indicated by the "G" suffix in the part number. They meet the European Union Restriction of Hazardous Substances directive requirements. However, always verify the latest compliance status with the manufacturer or authorized distributor, as regulations and product statuses can change.