10M40DCF256I7G
Intel
- Lifecycle
- Active
- Stock
- 4120 PCS
- Package
- LBGA-256
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Esta comparação detalhada entre 10M40DCF256I7G e 10M40DAF256I6G fornece informações valiosas sobre suas especificações e principais características. Abordamos fatores importantes em detalhes, incluindo conformidade com RoHS, status REACH, série, estilo de montagem, tipo de encapsulamento e outras características relevantes. Apresentar as diferenças lado a lado simplifica a seleção de componentes, facilitando a escolha da melhor opção para sua aplicação específica.
Replacement verdict
The 10M40DCF256I7G and 10M40DAF256I6G are both Intel MAX 10 FPGA devices sharing the same 40K logic element density and 256-ball FineLine BGA package, making them functionally interchangeable in most designs. The primary distinction lies in speed grade and operating temperature range, which may affect timing closure and thermal margins in demanding applications. Designers should validate timing performance and thermal requirements before committing to a direct substitution.
Intel
Intel
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M40DCF256I7G | 10M40DAF256I6G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both devices belong to the same Intel MAX 10 FPGA family, which is essential for pinout, toolchain, and IP compatibility. |
| Logic Elements (LEs) | 40,000 | 40,000 | Matching logic density ensures equivalent capacity for implementing the same design without resource overflow. |
| Embedded Memory | 1,260 Kbit | 1,260 Kbit | Identical on-chip memory supports the same buffering, FIFO, and data storage requirements. |
| Package | 256-pin FBGA | 256-pin FBGA | Same package and pin count allow a drop-in board-level replacement without PCB redesign. |
| Operating Temperature Range | -40°C to +100°C (Industrial) | -40°C to +100°C (Industrial) | Equivalent temperature grades ensure both parts can be used in the same industrial environments. |
| Speed Grade | 7 (Fastest) | 6 (Faster) | Different speed grades affect maximum operating frequency and timing closure; a faster grade may be substituted but timing must be re-verified. |
| Configuration Method | Dual Configuration (CF) | Single Configuration (AF) | Dual-configuration devices support two images for fail-safe updates, while single-configuration devices store only one image, affecting boot flexibility. |
| On-Chip Flash | Yes (Dual) | Yes (Single) | The amount of integrated configuration flash determines whether the device can hold one or two configuration images without external memory. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Identical core voltage ensures the same power supply design and decoupling scheme can be reused. |
| I/O Standards Support | LVCMOS, LVTTL, SSTL, HSTL, LVDS, etc. | LVCMOS, LVTTL, SSTL, HSTL, LVDS, etc. | Matching I/O standards guarantee compatibility with the same peripheral interfaces and signal levels. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M40DCF256I7G | 10M40DAF256I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 2500 | 2500 |
| Number of Logic Elements/Cells | 40000 | 40000 |
| Total RAM Bits | 1290240 | 1290240 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
Both devices are Intel (Altera) MAX 10 field-programmable gate arrays (FPGAs) in the same 256-ball FineLine BGA (FBGA) package with 40,000 logic elements (LEs). The primary differences are the speed grade and the operating temperature range: the 10M40DCF256I7G is specified with a speed grade of 7 and an industrial temperature range (I7), while the 10M40DAF256I6G is specified with a faster speed grade of 6 and an industrial temperature range (I6). The suffix "D" indicates dual-supply configuration flash and "F" denotes the FBGA package option; both share the same 10M40D family feature set, including integrated analog-to-digital converters (ADCs) and flash memory.
Yes. Both devices are offered in the same 256-ball FineLine BGA (FBGA) package with identical pinouts as defined by the Intel MAX 10 device pin-out files. Because the package, ball count, and device family are the same, the physical footprint and pin functions are compatible. However, designers must still verify that the differing speed grade and temperature grade meet the timing and environmental requirements of the target application before substituting one for the other.
In Intel MAX 10 nomenclature, a lower speed grade number indicates a faster device. Therefore, the 10M40DAF256I6G (speed grade 6) offers faster maximum operating frequencies and shorter propagation delays than the 10M40DCF256I7G (speed grade 7). The exact performance delta depends on the specific timing parameter and operating conditions, and must be confirmed using the Intel MAX 10 device datasheet timing models. A design closed with the slower grade 7 device will generally also close with the faster grade 6 device, but the reverse is not guaranteed.
Both the 10M40DCF256I7G and the 10M40DAF256I6G are industrial-grade devices. In Intel MAX 10 ordering codes, the "I" prefix denotes industrial temperature range, and the trailing digit (7 or 6) is the speed grade, not a separate temperature rating. Both devices are rated for the industrial temperature range specified in the Intel MAX 10 datasheet (typically -40°C to +100°C junction temperature, TJ). Designers should confirm the exact TJ limits from the official Intel MAX 10 device datasheet for the specific ordering code.
Physical and pin-level drop-in compatibility is supported because both are 256-ball FBGA MAX 10 devices with the same pinout. However, a true drop-in replacement also requires timing and configuration compatibility. Replacing the faster speed grade 6 device (10M40DAF256I6G) with the slower speed grade 7 device (10M40DCF256I7G) may violate timing closure if the design was optimized for grade 6 performance. The configuration bitstream is also device-specific and must be regenerated for the target ordering code. Intel recommends recompiling and re-validating the design before substitution.
Yes. Both the 10M40DCF256I7G and the 10M40DAF256I6G belong to the Intel MAX 10 10M40 device family and include the same dual-configuration flash (D suffix) architecture, integrated analog-to-digital converter (ADC) blocks, and internal configuration flash memory. They support the same configuration schemes, including internal configuration from on-chip flash and external configuration via JTAG or other supported modes, as documented in the Intel MAX 10 FPGA device family datasheet and configuration user guides.
Selection depends on the design's timing margin and cost targets. The 10M40DAF256I6G (speed grade 6) provides higher maximum operating frequencies and is preferable when timing closure is tight or when higher performance is required. The 10M40DCF256I7G (speed grade 7) is typically a lower-cost option and is suitable when the design meets timing at the slower grade. Both share the same 256-ball FBGA package, 40,000 LE density, and industrial temperature rating, so the decision is primarily driven by speed grade requirements and availability. Final selection should be validated against the Intel MAX 10 datasheet and the specific design's timing analysis.