Part A
10M40DCF672C8G
Intel
- Lifecycle
- Active
- Stock
- 5081 PCS
- Package
- BGA-672
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M40DCF672C8G and 10M40DAF484I6G share the same Intel MAX 10 FPGA family, 40,000 logic elements, and core architecture, making them functionally related. However, they differ in package type, operating temperature grade, and speed grade, so the 10M40DAF484I6G is not a direct drop-in replacement for the 10M40DCF672C8G without design and thermal validation.
Logic Density
High match
Package Type
Validation required
Operating Temperature
Not compatible
Speed Grade
Validation required
Parts at a glance
Part B
10M40DAF484I6G
Intel
- Lifecycle
- Active
- Stock
- 8575 PCS
- Package
- BGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M40DCF672C8G | 10M40DAF484I6G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Same device family ensures similar architecture, toolchain support, and IP compatibility. |
| Logic Elements (LEs) | 40000 | 40000 | Equal logic capacity means comparable design density and resource availability. |
| Package / Case | 672-FBGA (FineLine BGA) | 484-FBGA (FineLine BGA) | Different package sizes affect PCB footprint, routing, and mechanical fit. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | -40°C to 100°C (Industrial) | Temperature grade determines suitability for commercial versus harsh industrial environments. |
| Speed Grade | 8 | 6 | Speed grade affects maximum operating frequency and timing closure margins. |
| Supply Voltage - Core | 1.2 V | 1.2 V | Core voltage must match power supply design and level-shifting requirements. |
| Number of I/Os | 500 | 360 | I/O count limits the number of external interfaces and peripherals that can be connected. |
| Embedded Memory | 1260 kbit | 1260 kbit | On-chip memory capacity impacts buffering, FIFO depth, and data storage capability. |
| Mounting Type | Surface Mount | Surface Mount | Mounting style must match the assembly process and board design. |
| RoHS Compliance | Compliant | Compliant | RoHS status affects regulatory compliance for product shipments in many regions. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M40DCF672C8G | 10M40DAF484I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 2500 | 2500 |
| Number of Logic Elements/Cells | 40000 | 40000 |
| Total RAM Bits | 1290240 | 1290240 |
| Number of I/O | 500 | 360 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 10M40DCF672C8G and the 10M40DAF484I6G?
The primary differences are package type, operating temperature range, and speed grade. The 10M40DCF672C8G is a 672-pin FineLine BGA (FBGA) device with a commercial temperature range (0°C to 85°C junction) and speed grade 8. The 10M40DAF484I6G is a 484-pin FineLine BGA (FBGA) device with an industrial temperature range (-40°C to 100°C junction) and speed grade 6. Both are Intel (formerly Altera) MAX 10 family FPGAs with 40,000 logic elements.
Are the 10M40DCF672C8G and 10M40DAF484I6G pin-to-pin compatible?
No. The 10M40DCF672C8G uses a 672-pin FBGA package, while the 10M40DAF484I6G uses a 484-pin FBGA package. The different pin counts and package body sizes result in different PCB footprints and pin assignments, so they are not pin-to-pin compatible.
Can the 10M40DCF672C8G and 10M40DAF484I6G be used interchangeably in the same design?
No, they cannot be used interchangeably without design changes. The different package sizes require different PCB land patterns, and the different speed grades and temperature ranges affect timing closure and operating environment suitability. A redesign of the PCB layout and revalidation of timing would be required.
What is the logic capacity of the 10M40DCF672C8G and 10M40DAF484I6G?
Both devices are part of the Intel MAX 10 FPGA family and feature 40,000 logic elements (LEs). They also include integrated analog-to-digital converter (ADC) blocks, flash memory, and other MAX 10 family features as documented in the Intel MAX 10 FPGA device datasheet.
What are the operating temperature ranges for the 10M40DCF672C8G and 10M40DAF484I6G?
The 10M40DCF672C8G is specified for commercial operation with a junction temperature range of 0°C to 85°C. The 10M40DAF484I6G is specified for industrial operation with a junction temperature range of -40°C to 100°C. The industrial-grade device is suitable for harsher environments.
What speed grades are available for the 10M40DCF672C8G and 10M40DAF484I6G?
The 10M40DCF672C8G has a speed grade of 8, while the 10M40DAF484I6G has a speed grade of 6. In Intel FPGA nomenclature, a lower speed grade number indicates a faster device with shorter propagation delays and higher maximum operating frequencies. Therefore, the 10M40DAF484I6G (speed grade 6) is faster than the 10M40DCF672C8G (speed grade 8).
Do the 10M40DCF672C8G and 10M40DAF484I6G support the same configuration methods?
Yes. Both devices are MAX 10 FPGAs and support the same configuration schemes, including internal configuration from on-chip flash, dual configuration images, and external configuration via JTAG. Configuration details are documented in the Intel MAX 10 FPGA configuration user guide.
Which device should be selected for a new design requiring industrial temperature operation?
The 10M40DAF484I6G should be selected for industrial temperature operation because it is rated for -40°C to 100°C junction temperature. The 10M40DCF672C8G is only rated for commercial temperatures (0°C to 85°C junction) and is not suitable for industrial environments without additional thermal management or derating.