10M50DAF256I6G
Intel
- Lifecycle
- Active
- Stock
- 5635 PCS
- Package
- LBGA-256
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Esta comparação detalhada entre 10M50DAF256I6G e 10M50DCF256C7G fornece informações valiosas sobre suas especificações e principais características. Abordamos fatores importantes em detalhes, incluindo conformidade com RoHS, status REACH, série, estilo de montagem, tipo de encapsulamento e outras características relevantes. Apresentar as diferenças lado a lado simplifica a seleção de componentes, facilitando a escolha da melhor opção para sua aplicação específica.
Replacement verdict
The 10M50DAF256I6G and 10M50DCF256C7G are both Intel MAX 10 FPGA devices sharing the same 50,000 logic element density and 256-ball FineLine BGA footprint, making them functionally interchangeable at the board level. However, they differ in speed grade and operating temperature range, so the 10M50DCF256C7G can serve as a replacement for the 10M50DAF256I6G only when the target application tolerates the faster C7 speed grade and the narrower commercial temperature window. Designers must validate timing closure and thermal margins before committing to this substitution.
Intel
Intel
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M50DAF256I6G | 10M50DCF256C7G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both devices belong to the same MAX 10 FPGA family, which is the baseline requirement for functional substitutability. |
| Logic Elements (LEs) | 50,000 | 50,000 | Matching logic density ensures equivalent programmable logic capacity for the target design. |
| Embedded Memory | 1,638 Kbits | 1,638 Kbits | Identical on-chip memory supports the same buffering, FIFO, and data storage requirements. |
| Package | 256-FBGA (17x17) | 256-FBGA (17x17) | Same package and footprint allow drop-in board-level replacement without PCB redesign. |
| Operating Temperature Range | -40°C to 100°C (Industrial) | 0°C to 85°C (Commercial) | The industrial-grade device supports harsher environments, while the commercial-grade part is limited to benign conditions; this affects deployment suitability. |
| Speed Grade | 6 | 7 | A faster speed grade (lower number) provides higher maximum operating frequency and tighter timing margins, which can affect timing closure. |
| Core Supply Voltage | 1.2 V | 1.2 V | Identical core voltage means the same power supply design and decoupling network can be reused. |
| Configuration Method | Instant-on / Internal Configuration | Instant-on / Internal Configuration | Both support single-chip instant-on operation, eliminating the need for external configuration memory. |
| Analog-to-Digital Converter (ADC) | Yes (12-bit, 1 Msps) | Yes (12-bit, 1 Msps) | Integrated ADC availability is identical, so analog monitoring and sensing functions remain supported. |
| RoHS / Lead-Free | Yes | Yes | Both parts are RoHS-compliant, satisfying environmental and regulatory requirements for production. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M50DAF256I6G | 10M50DCF256C7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 3125 | 3125 |
| Number of Logic Elements/Cells | 50000 | 50000 |
| Total RAM Bits | 1677312 | 1677312 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
The primary differences are speed grade, temperature grade, and package option. The 10M50DAF256I6G is a 10M50D device in a 256-pin FineLine BGA (FBGA) package with speed grade 6 and industrial temperature range. The 10M50DCF256C7G is a 10M50D device in a 256-pin FBGA package with speed grade 7 and commercial temperature range. Both are Intel MAX 10 FPGA devices with 50,000 logic elements, but the "F" and "C" suffixes indicate different package/ordering options, and the "I6" versus "C7" suffixes indicate industrial speed grade 6 versus commercial speed grade 7.
Both devices are offered in a 256-pin FBGA package, but pin compatibility cannot be assumed solely from the package name. The 10M50DAF256I6G uses the "F256" package designation, while the 10M50DCF256C7G uses the "F256" package designation as well, but the ordering codes differ in speed and temperature grade. Designers must verify pinout, I/O bank assignments, and configuration pin behavior against the respective Intel MAX 10 device pin-out files before treating them as drop-in replacements.
Not necessarily. The 10M50DAF256I6G is rated for industrial temperature range and speed grade 6, while the 10M50DCF256C7G is rated for commercial temperature range and speed grade 7. A direct substitution requires validating timing closure, operating temperature requirements, and any configuration or I/O voltage differences against the Intel MAX 10 datasheet and the target design specifications.
Both devices are members of the Intel MAX 10 FPGA family with the 10M50 density grade, which provides 50,000 logic elements (LEs). They also include integrated analog-to-digital converter (ADC) blocks, flash memory, and other MAX 10 family features. Exact resource counts such as M9K memory blocks, DSP blocks, and user I/O pins should be confirmed from the Intel MAX 10 device datasheet for the specific package and ordering code.
In the 10M50DAF256I6G, the "I6" suffix indicates industrial temperature range and speed grade 6. In the 10M50DCF256C7G, the "C7" suffix indicates commercial temperature range and speed grade 7. Speed grade affects maximum operating frequency and timing performance, while temperature grade defines the ambient or junction temperature range over which the device is guaranteed to operate within specification.
The 10M50DAF256I6G is better suited for industrial applications requiring operation over the industrial temperature range and the timing characteristics of speed grade 6. The 10M50DCF256C7G is intended for commercial-temperature applications where speed grade 7 timing is acceptable. Selection should be based on the system's temperature environment, timing margin, and power budget, as documented in the Intel MAX 10 datasheet and device pin-out files.
Both the 10M50DAF256I6G and 10M50DCF256C7G are Intel MAX 10 FPGA devices and support the same MAX 10 configuration schemes, including internal configuration from on-chip flash, JTAG configuration, and external configuration from a host or configuration device. The available configuration options and pin assignments should be verified in the Intel MAX 10 General Purpose I/O User Guide and the device pin-out files for the 256-pin FBGA package.
Verified technical data is available from Intel (now Altera) official documentation, including the MAX 10 FPGA Device Datasheet, MAX 10 FPGA Device Pin-Out Files, and MAX 10 General Purpose I/O User Guide. Distributor sources such as DigiKey, Mouser, TTI, and Future Electronics also list ordering information, package details, and environmental ratings for these ordering codes. Always confirm final parameters against the manufacturer datasheet for the exact ordering code.