25LC256T-E/SN
Tecnologia Microchip
- Lifecycle
- Active
- Stock
- 2848 PCS
- Package
- SOIC-8
- Series
- Memória
Esta comparação detalhada entre 25LC256T-E/SN e 25LC256-E/SN16KVAO fornece informações valiosas sobre suas especificações e principais características. Abordamos fatores importantes em detalhes, incluindo conformidade com RoHS, status REACH, série, estilo de montagem, tipo de encapsulamento e outras características relevantes. Apresentar as diferenças lado a lado simplifica a seleção de componentes, facilitando a escolha da melhor opção para sua aplicação específica.
Replacement verdict
The 25LC256T-E/SN and 25LC256-E/SN16KVAO are functionally compatible SPI serial EEPROM devices sharing identical memory density, interface protocol, and supply voltage range. The 25LC256-E/SN16KVAO carries an automotive-grade qualification that extends its operating temperature range, making it suitable for both the industrial applications served by the 25LC256T-E/SN and harsher automotive environments. Designers should verify package footprint and temperature requirements before substituting.
Tecnologia Microchip
Tecnologia Microchip
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 25LC256T-E/SN | 25LC256-E/SN16KVAO | Why it matters |
|---|---|---|---|
| Memory Type | EEPROM | EEPROM | Both are serial EEPROM devices, so the fundamental memory technology is the same. |
| Memory Organization | 32K x 8 | 32K x 8 | Identical organization means the same address space and byte-level access behavior. |
| Memory Size | 256 Kbit | 256 Kbit | Same density ensures equivalent storage capacity for the application. |
| Interface | SPI | SPI | Both use SPI, so they are compatible with the same host controller interface. |
| Clock Frequency | 10 MHz | 10 MHz | Same maximum clock rate means comparable read/write throughput. |
| Supply Voltage | 2.5 V to 5.5 V | 2.5 V to 5.5 V | Identical operating voltage range allows use in the same power supply designs. |
| Operating Temperature Range | -40°C to +125°C | -40°C to +125°C | Same temperature range supports equivalent environmental robustness. |
| Mounting Type | Surface Mount | Surface Mount | Both are surface-mount devices, so they fit the same PCB assembly process. |
| Package / Case | 8-SOIC | 8-SOIC | Same package and footprint enable direct board-level substitution. |
| Packaging | Tape & Reel | Tube | Different packaging affects handling and automated assembly, though the device itself is the same. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 25LC256T-E/SN | 25LC256-E/SN16KVAO |
|---|---|---|
| Supplier | - | Microchip Technology |
| Series | - | Automotive, AEC-Q100 |
| Part Status | Active | Active |
| Memory Type | Non-Volatile | Non-Volatile |
| Memory Format | EEPROM | EEPROM |
| Technology | EEPROM | EEPROM |
| Memory Size | 256Kb (32K x 8) | 256Kb (32K x 8) |
| Memory Interface | SPI | SPI |
| Clock Frequency | 10 MHz | 5 MHz |
| Write Cycle Time - Word Page | 5ms | 5ms |
| Voltage - Supply | 2.5V ~ 5.5V | 2.5V ~ 5.5V |
| Operating Temperature | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) |
| Mounting Type | Surface Mount | Surface Mount |
The 25LC256T-E/SN is a 256 Kbit SPI serial EEPROM in an 8-lead SOIC package, supplied in tape and reel. The 25LC256-E/SN16KVAO is the same 256 Kbit SPI serial EEPROM die in the same 8-lead SOIC package, but it is an automotive-qualified version (AEC-Q100) with a specific ordering suffix indicating automotive qualification and a different packing or qualification flow. The core memory density, interface, and package footprint are the same; the primary differences are qualification grade, ordering suffix, and shipping format.
Yes. Both devices use the standard 8-lead SOIC (SN) package with the same pinout: CS, SO, WP, VSS, SI, SCK, HOLD, and VCC. They are pin-to-pin compatible when the package and temperature grade requirements of the target design are met.
Both are 256 Kbit serial EEPROMs organized as 32,768 bytes (32 K x 8). They support byte-level and page-level writes with a 64-byte page size and provide sequential read capability.
Both devices support SPI modes 0 (0,0) and 3 (1,1). The maximum clock frequency is 10 MHz for standard read and write operations, and up to 20 MHz for high-speed read operations, as specified in the manufacturer datasheet.
Both devices operate from 2.5 V to 5.5 V. The 25LC256T-E/SN is specified for the extended industrial temperature range of -40°C to +125°C. The 25LC256-E/SN16KVAO is also specified for -40°C to +125°C, but with automotive qualification and screening per AEC-Q100 requirements.
Functionally, the 25LC256-E/SN16KVAO can replace the 25LC256T-E/SN in many designs because the die, package, pinout, and electrical parameters are essentially the same. However, the 25LC256-E/SN16KVAO carries automotive qualification and may have different documentation, traceability, and change notification requirements. The designer must verify that the automotive qualification status and any additional screening meet the specific application requirements.
The "16KVAO" suffix is an ordering code used by Microchip to denote an automotive-qualified device with specific qualification and documentation requirements. It indicates the device is qualified to AEC-Q100 standards and is intended for automotive applications. The exact meaning of each character in the suffix should be confirmed with the manufacturer's ordering guide.
Yes. Both devices provide hardware write protection via the WP pin and software write protection through status register block protection bits. They also include a HOLD pin for pausing serial communication. The security and protection feature set is identical because they share the same silicon design.
The 25LC256T-E/SN is supplied in an 8-lead SOIC package in tape and reel (T suffix). The 25LC256-E/SN16KVAO is also supplied in an 8-lead SOIC package, but the "16KVAO" suffix indicates a specific automotive qualification and packing configuration. Both use the same SOIC-8 body size and lead pitch, so PCB layout is identical.