Part A
5CEBA2F17C8N
Intel
- Lifecycle
- Active
- Stock
- 4153 PCS
- Package
- BGA-256
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 5CEBA2F17C8N and 5CEBA2U19C7N are both Intel Cyclone V FPGA devices sharing the same logic density and core architecture, making them functionally related candidates. However, they differ in package type, pin count, and speed grade, so board-level compatibility is not guaranteed. The 5CEBA2U19C7N offers a higher speed grade but a smaller package, while the 5CEBA2F17C8N provides more user I/O in a larger FBGA package. Designers must validate footprint, thermal, and timing requirements before substituting.
Logic Density
High match
Package Type
Validation required
Pin Count
Not compatible
Speed Grade
Validation required
Parts at a glance
Part B
5CEBA2U19C7N
Intel
- Lifecycle
- Active
- Stock
- 7477 PCS
- Package
- FBGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEBA2F17C8N | 5CEBA2U19C7N | Why it matters |
|---|---|---|---|
| Package / Case | FBGA-256 (17 x 17 mm, 1.0 mm pitch) | UBGA-484 (19 x 19 mm, 0.8 mm pitch) | Different package footprint and ball pitch require different PCB land patterns, so the two devices are not drop-in board-compatible. |
| Logic Elements (LE) | 25,000 | 25,000 | Identical logic density means both can implement the same scale of digital design, supporting functional substitutability at the fabric level. |
| Total RAM Bits | 1,080,000 | 1,080,000 | Equal embedded memory capacity allows the same buffering, FIFO, and data-storage functions in either device. |
| Number of I/Os | 128 | 224 | The U19 variant exposes more user I/Os, which can matter when the design needs additional external interfaces or wider buses. |
| Speed Grade | 8 (fastest) | 7 (slower) | A faster speed grade supports higher clock frequencies and tighter timing closure, so timing-critical designs may not port directly to the slower grade. |
| Operating Temperature Range | 0°C to +85°C (commercial) | 0°C to +85°C (commercial) | Matching temperature ranges mean both parts suit the same commercial environment without derating or thermal redesign. |
| Core Supply Voltage | 1.1 V | 1.1 V | Same core voltage allows reuse of the same power supply design and decoupling strategy for either device. |
| Number of Transceivers | 0 | 0 | Neither device includes high-speed serial transceivers, so both are limited to general-purpose I/O and parallel interfaces. |
| Embedded Multipliers (18x18) | 66 | 66 | Equal DSP block count means arithmetic-intensive functions such as filters and MACs can be mapped identically on either part. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEBA2F17C8N | 5CEBA2U19C7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 9434 | 9434 |
| Number of Logic Elements/Cells | 25000 | 25000 |
| Total RAM Bits | 2002944 | 2002944 |
| Number of I/O | 128 | 224 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the 5CEBA2F17C8N and 5CEBA2U19C7N devices?
Both are Intel (formerly Altera) Cyclone V E series field-programmable gate arrays (FPGAs). The 5CEBA2F17C8N is a 484-pin FineLine BGA (FBGA) device, while the 5CEBA2U19C7N is a 484-pin Ultra FineLine BGA (UBGA) device. Both belong to the Cyclone V E family with 25K logic elements.
What is the difference in package type between the 5CEBA2F17C8N and 5CEBA2U19C7N?
The 5CEBA2F17C8N uses a 484-pin FineLine BGA (FBGA) package with a 1.0 mm ball pitch. The 5CEBA2U19C7N uses a 484-pin Ultra FineLine BGA (UBGA) package with a 0.8 mm ball pitch. The UBGA package is smaller in physical footprint than the FBGA package.
Are the 5CEBA2F17C8N and 5CEBA2U19C7N pin-compatible?
No. Although both have 484 balls, the FBGA and UBGA packages have different ball pitches (1.0 mm vs 0.8 mm) and different physical dimensions. The PCB land patterns and ball maps differ, so they are not drop-in replacements for each other.
What is the speed grade difference between the 5CEBA2F17C8N and 5CEBA2U19C7N?
The 5CEBA2F17C8N has a speed grade of 8 (C8), while the 5CEBA2U19C7N has a speed grade of 7 (C7). A lower speed grade number indicates a faster device in Intel FPGA nomenclature, so the C7 device offers higher performance than the C8 device.
Do the 5CEBA2F17C8N and 5CEBA2U19C7N have the same logic density and resources?
Yes. Both are Cyclone V E A2 variants with 25,000 logic elements (LEs), 9,880 adaptive logic modules (ALMs), and 1,880 Kbits of embedded memory. They also both include 66 embedded 18x18 multipliers and 4 fractional PLLs. The primary differences are package type and speed grade.
What is the operating temperature range for the 5CEBA2F17C8N and 5CEBA2U19C7N?
Both devices are specified for commercial temperature range operation, typically 0°C to 85°C junction temperature (TJ). The "C" in the speed grade suffix (C8 and C7) indicates commercial grade. Industrial-grade versions would carry an "I" suffix.
Can the 5CEBA2F17C8N be used as a substitute for the 5CEBA2U19C7N in an existing design?
No, not without a PCB redesign. The different package types (FBGA vs UBGA) require different PCB footprints, ball pitches, and routing. Additionally, the speed grade difference (C8 vs C7) affects timing closure and may require design re-timing if the faster C7 device is replaced by the slower C8 device.
What are the typical applications for the 5CEBA2F17C8N and 5CEBA2U19C7N?
Both devices are used in applications requiring moderate logic density and low power, such as industrial automation, motor control, protocol bridging, image processing, and embedded system glue logic. The UBGA version (5CEBA2U19C7N) is often chosen for space-constrained designs, while the FBGA version (5CEBA2F17C8N) may be preferred where standard 1.0 mm pitch assembly processes are available.