Part A
5CEBA4F23C8N
Intel
- Lifecycle
- Active
- Stock
- 6956 PCS
- Package
- FBGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 5CEBA4F23C8N and 5CEBA2F17C6N are both Intel Cyclone V FPGAs sharing the same core architecture and logic cell family, making them functionally related but not drop-in equivalents. The 5CEBA4F23C8N offers higher logic density and a larger package footprint, while the 5CEBA2F17C6N provides a smaller, lower-density alternative with a faster speed grade. Designers must validate logic utilization, I/O count, and PCB layout compatibility before substituting one for the other.
Logic Density
Validation required
Package Type
Validation required
Core Architecture
High match
Speed Grade
Validation required
Parts at a glance
Part B
5CEBA2F17C6N
Intel
- Lifecycle
- Active
- Stock
- 5923 PCS
- Package
- LBGA-256
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEBA4F23C8N | 5CEBA2F17C6N | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 49000 | 25000 | Logic element count determines the amount of digital logic that can be implemented, directly affecting design capacity and substitutability. |
| Total RAM Bits | 3036160 | 1382400 | Embedded memory capacity limits buffering, FIFO depth, and data storage within the FPGA fabric. |
| Number of I/Os | 224 | 128 | Available I/O pins constrain peripheral interfacing and board-level connectivity options. |
| Package / Case | 484-FBGA (23x23) | 256-FBGA (17x17) | Package footprint and ball count must match the PCB layout for physical compatibility. |
| Operating Temperature Range | 0°C to 85°C (TJ) | 0°C to 85°C (TJ) | Temperature grade affects reliability and suitability for commercial versus industrial environments. |
| Speed Grade | 8 | 6 | Speed grade determines maximum achievable clock frequency and timing closure margins. |
| Supply Voltage - Core | 1.07V to 1.13V | 1.07V to 1.13V | Core voltage must match the board power design to avoid damage or malfunction. |
| Number of LABs / CLBs | 1848 | 943 | Logic array blocks indicate granularity of logic resources and influence place-and-route feasibility. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEBA4F23C8N | 5CEBA2F17C6N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 18480 | 9434 |
| Number of Logic Elements/Cells | 49000 | 25000 |
| Total RAM Bits | 3464192 | 2002944 |
| Number of I/O | 224 | 128 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEBA4F23C8N and 5CEBA2F17C6N FPGA devices?
The 5CEBA4F23C8N is a Cyclone V E FPGA with 49,000 logic elements, 23,000 adaptive logic modules, and 3,080 Kbits of embedded memory in a 484-pin FBGA package. The 5CEBA2F17C6N is a Cyclone V E FPGA with 25,000 logic elements, 9,500 adaptive logic modules, and 1,400 Kbits of embedded memory in a 256-pin FBGA package. The 5CEBA4F23C8N offers higher logic density, more memory, and a larger package, while the 5CEBA2F17C6N provides a smaller footprint and lower logic capacity.
Are the 5CEBA4F23C8N and 5CEBA2F17C6N pin-compatible?
No. The 5CEBA4F23C8N uses a 484-pin FBGA package, while the 5CEBA2F17C6N uses a 256-pin FBGA package. The different pin counts and package sizes mean they are not pin-compatible and cannot be used as drop-in replacements without PCB redesign.
What are the operating temperature ranges for the 5CEBA4F23C8N and 5CEBA2F17C6N?
Both devices are specified for commercial temperature range operation, typically 0°C to 85°C junction temperature, as indicated by the "C" in the ordering code (C8N and C6N). The 5CEBA4F23C8N has a speed grade of 8, while the 5CEBA2F17C6N has a speed grade of 6, indicating the latter is a faster speed grade within the Cyclone V E family.
Can the 5CEBA4F23C8N and 5CEBA2F17C6N be used in the same design interchangeably?
No. Due to differences in logic element count (49,000 vs 25,000), adaptive logic modules (23,000 vs 9,500), embedded memory (3,080 Kbits vs 1,400 Kbits), package size (484-pin vs 256-pin FBGA), and speed grade (8 vs 6), these devices are not interchangeable. A design targeting one device would require significant rework, including pinout changes, resource reallocation, and timing revalidation, to use the other.
What is the difference in speed grade between the 5CEBA4F23C8N and 5CEBA2F17C6N?
The 5CEBA4F23C8N has a speed grade of 8, and the 5CEBA2F17C6N has a speed grade of 6. In Altera/Intel Cyclone V FPGA ordering codes, a lower speed grade number indicates a faster device. Therefore, the 5CEBA2F17C6N (speed grade 6) is faster than the 5CEBA4F23C8N (speed grade 8) in terms of maximum operating frequency and timing performance.
Do the 5CEBA4F23C8N and 5CEBA2F17C6N support the same configuration methods?
Both devices are Cyclone V E FPGAs and support the same configuration schemes, including active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG configuration. However, the configuration bitstream size differs due to different logic densities, so the same configuration file cannot be used for both devices.
Which device is more suitable for a space-constrained application?
The 5CEBA2F17C6N is more suitable for space-constrained applications because it uses a 256-pin FBGA package, which is significantly smaller than the 484-pin FBGA package of the 5CEBA4F23C8N. The smaller package also requires less PCB area and fewer I/O pins, but it provides lower logic capacity and memory resources.