Part A
5CEFA2F23C7N
Altera
- Lifecycle
- Active
- Stock
- 9580 PCS
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Not a drop-in replacement
The 5CEFA9F27I7N and 5CEFA2F23C7N are not drop-in replacements for each other. They differ fundamentally in logic density, package footprint, and operating temperature grade, making them suitable for different design requirements rather than interchangeable use.
Different logic density
Different package footprint
Different temperature grade
Different I/O count
Parts at a glance
Part B
5CEFA9F27I7N
Intel
- Lifecycle
- Active
- Stock
- 7586 PCS
- Package
- BGA-672
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA9F27I7N | 5CEFA2F23C7N | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 301000 | 25000 | Logic element count determines the maximum complexity of digital designs the FPGA can implement; a large mismatch means the two devices are not functionally interchangeable for most designs. |
| Total RAM Bits | 14251008 | 1945600 | Embedded memory capacity limits buffering, FIFO depth, and data storage on-chip; designs relying on large memory blocks cannot be ported between these devices. |
| Number of I/Os | 336 | 224 | Available user I/O pins constrain external interfacing; fewer pins on the smaller device may prevent direct substitution in I/O-heavy applications. |
| Package / Case | 672-BGA (27x27) | 484-FBGA (23x23) | Package footprint and ball pitch must match the PCB layout; different packages are not drop-in compatible. |
| Operating Temperature Range | -40°C to 100°C (TJ) | 0°C to 85°C (TJ) | Industrial-grade temperature range versus commercial range affects suitability for harsh environments and reliability margins. |
| Speed Grade | 7 (fastest) | 7 (fastest) | Speed grade determines maximum achievable clock frequency and timing closure; matching grades simplifies timing migration. |
| Supply Voltage - Core | 1.10 V | 1.10 V | Core voltage must match the board power design; identical values allow reuse of the same power delivery network. |
| Number of LABs / CLBs | 113560 | 9434 | Logic array blocks define granular logic resources; a large difference indicates very different capacity classes. |
| Series | Cyclone V E | Cyclone V E | Same device family ensures toolchain and IP compatibility, though density differences still prevent direct substitution. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA2F23C7N | 5CEFA9F27I7N |
|---|---|---|
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Digi Key Programmable | Not Verified | - |
| Total RAM Bits | 2002944 | 14251008 |
| Number of I/O | 224 | 336 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
| Base Product Number | 5CEFA2 | - |
| Number of Logic Elements / Cells | 25000 | - |
| Number of LA Bs / CL Bs | 9434 | - |
| Number of LABs/CLBs | - | 113560 |
| Number of Logic Elements/Cells | - | 301000 |
Frequently asked questions
What are the key differences between the 5CEFA9F27I7N and the 5CEFA2F23C7N?
The 5CEFA9F27I7N is a larger Cyclone V FPGA in the F27 package with 301,000 logic elements, 13,917 Kbits of embedded memory, and 480 18x18 multipliers, while the 5CEFA2F23C7N is a smaller Cyclone V FPGA in the F23 package with 25,000 logic elements, 1,864 Kbits of embedded memory, and 72 18x18 multipliers. The 5CEFA9F27I7N also has a higher maximum operating temperature grade (I7, industrial) compared to the C7 (commercial) grade of the 5CEFA2F23C7N.
Are the 5CEFA9F27I7N and 5CEFA2F23C7N pin-to-pin compatible?
No. The 5CEFA9F27I7N uses the F27 package (672 pins), while the 5CEFA2F23C7N uses the F23 package (484 pins). The different package sizes, pin counts, and ball maps prevent direct pin-to-pin compatibility.
Can the 5CEFA2F23C7N be used as a drop-in replacement for the 5CEFA9F27I7N?
No. The two devices differ in package footprint, logic density, memory resources, multiplier count, and temperature grade. A drop-in replacement is not possible without redesigning the PCB and verifying all electrical and timing requirements against the target application.
What are the operating temperature ranges for these two FPGAs?
The 5CEFA9F27I7N is specified for the industrial temperature grade with a junction temperature range of -40°C to +100°C (I7 speed grade). The 5CEFA2F23C7N is specified for the commercial temperature grade with a junction temperature range of 0°C to +85°C (C7 speed grade).
Do both devices belong to the same FPGA family and use the same configuration method?
Yes. Both are members of the Intel (formerly Altera) Cyclone V FPGA family and support the same configuration schemes, including active serial, passive serial, fast passive parallel, and JTAG configuration. However, configuration file sizes and device-specific settings differ due to different logic densities.
Which device offers more embedded memory and DSP resources?
The 5CEFA9F27I7N offers significantly more embedded memory (13,917 Kbits vs. 1,864 Kbits) and more 18x18 multipliers (480 vs. 72) than the 5CEFA2F23C7N. This makes the 5CEFA9F27I7N better suited for memory-intensive and DSP-heavy applications.
Are the speed grades of the 5CEFA9F27I7N and 5CEFA2F23C7N the same?
No. The 5CEFA9F27I7N has an I7 speed grade (industrial, faster), while the 5CEFA2F23C7N has a C7 speed grade (commercial, slower). The speed grade affects timing closure, maximum operating frequency, and power consumption, so timing analysis must be re-run if migrating between them.
What are the typical applications for each device?
The 5CEFA9F27I7N, with its higher logic density and industrial temperature range, is typically used in industrial automation, medical imaging, and high-performance embedded systems. The 5CEFA2F23C7N, with lower density and commercial temperature range, is typically used in consumer electronics, low-cost control applications, and commercial-grade embedded designs.