Part A
AD9777BSVZ
Analog Devices Inc.
- Lifecycle
- Active
- Stock
- 2987 PCS
- Package
- TQFP-80
- Series
- Acquisição de dados - Convertedores digitais para analógicos (DAC)
Replacement verdict
Compatible functional replacement candidate
The AD9777BSVZ and AD9777BSVRL are functionally identical, differing only in packaging format (tray vs. tape-and-reel). Both share the same 16-bit 160 MSPS dual DAC core, 80-lead TQFP-EP package, and industrial temperature range, making them interchangeable for design and production purposes. The tape-and-reel variant is recommended for automated SMT assembly lines, while the tray variant suits prototyping and low-volume runs.
Resolution and Sample Rate
High match
Package and Footprint
High match
Supply Voltage and Interface
High match
Operating Temperature Range
High match
Parts at a glance
Part B
AD9777BSVRL
Analog Devices Inc.
- Lifecycle
- Active
- Stock
- 5427 PCS
- Package
- TQFP-80
- Series
- Acquisição de dados - Convertedores digitais para analógicos (DAC)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | AD9777BSVZ | AD9777BSVRL | Why it matters |
|---|---|---|---|
| Resolution | 16 bit | 16 bit | Determines the quantization accuracy of the DAC output; both parts must match for identical signal fidelity. |
| Number of DAC Channels | 2 | 2 | Dual-channel architecture is required for I/Q signal generation; matching channel count ensures functional interchangeability. |
| Maximum Update Rate | 160 MSPS | 160 MSPS | Sets the maximum sample rate the DAC can support; identical rates ensure the same bandwidth capability. |
| Supply Voltage | 3.3 V | 3.3 V | Must match the system power rail; identical supply voltage allows drop-in replacement without power redesign. |
| Package / Case | 80-TQFP | 80-TQFP | Same package footprint ensures PCB layout compatibility and physical interchangeability. |
| Interface Type | Parallel | Parallel | Determines how data is fed to the DAC; matching interface ensures the same host controller can drive either part. |
| Operating Temperature Range | -40°C to +85°C | -40°C to +85°C | Ensures both parts operate over the same environmental conditions for the target application. |
| Packaging / Ordering Format | Tray | Tape & Reel | Affects manufacturing handling and assembly line compatibility; the reel version suits automated pick-and-place, while tray suits low-volume or prototype builds. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | AD9777BSVZ | AD9777BSVRL |
|---|---|---|
| Supplier | - | Rochester Electronics, LLC |
| Series | TxDAC+® | TxDAC+® |
| Part Status | Active | Obsolete |
| Number of Bits | 16 | - |
| Number of D/A Converters | 2 | - |
| Settling Time | 11µs (Typ) | - |
| Output Type | Current - Unbuffered | - |
| Differential Output | Yes | - |
| Data Interface | Parallel | - |
| Reference Type | External, Internal | - |
| Voltage - Supply, Analog | 3.1V ~ 3.5V | - |
| Voltage - Supply, Digital | 3.1V ~ 3.5V | - |
| INL / DNL(LSB) | ±6, ±3 | - |
| Architecture | Oversampling Interpolating DAC | - |
| Operating Temperature | -40°C ~ 85°C | - |
Frequently asked questions
What are the AD9777BSVZ and AD9777BSVRL?
Both are the same Analog Devices AD9777 16-bit, 400 MSPS dual-channel TxDAC+ digital-to-analog converter. The AD9777BSVZ is supplied in a 80-lead TQFP-EP (exposed pad) package in tray form, while the AD9777BSVRL is the same die and package supplied in tape-and-reel form for automated assembly.
Are the AD9777BSVZ and AD9777BSVRL electrically and functionally identical?
Yes. Both part numbers share the same AD9777 silicon, the same 80-lead TQFP-EP package, the same pinout, and the same specified performance (16-bit resolution, 400 MSPS update rate, dual DAC channels, on-chip interpolation filters, and programmable gain/offset). The only difference is the packaging format: tray (BSVZ) versus tape-and-reel (BSVRL).
Can the AD9777BSVZ and AD9777BSVRL be used interchangeably in a design?
Yes, from an electrical and footprint standpoint they are interchangeable because they are the same device in the same package. The choice between them is driven by manufacturing requirements: BSVZ trays suit low-volume or hand assembly, while BSVRL tape-and-reel suits high-volume automated pick-and-place lines.
What is the difference between the BSVZ and BSVRL suffixes?
The suffix denotes the shipping/ordering format rather than a device variant. "BSVZ" indicates the 80-lead TQFP-EP package in tray form, and "BSVRL" indicates the same package in tape-and-reel form. Both are RoHS-compliant per the "Z" designation in the Analog Devices ordering code.
What are the key performance specifications common to both parts?
Both are 16-bit dual-channel DACs with a maximum update rate of 400 MSPS, an on-chip 2x/4x/8x interpolating filter, programmable channel gain and offset, and a serial peripheral interface for configuration. They operate from a 3.3 V analog supply with a 1.8 V to 3.3 V digital interface and are specified over the industrial temperature range.
Do both parts require the same external components and layout?
Yes. Because the AD9777BSVZ and AD9777BSVRL are the same die in the same 80-lead TQFP-EP package, they require identical decoupling, reference, clock, and output filtering networks, and the same PCB land pattern with the exposed pad soldered to ground. No layout change is needed when switching between the two ordering codes.
Which part should be selected for high-volume production?
For high-volume automated assembly, the AD9777BSVRL tape-and-reel format is generally preferred because it supports pick-and-place equipment and standard reflow processing. The AD9777BSVZ tray format is typically used for prototyping, low-volume runs, or manual assembly.