ADSP-BF548BBCZ-5A
Analog Devices Inc.
- Lifecycle
- Active
- Stock
- 6104 PCS
- Package
- LFBGA-400
- Series
- Embedded - DSP
Esta comparação detalhada entre ADSP-BF548BBCZ-5A e ADSP-BF536BBC-4A fornece informações valiosas sobre suas especificações e principais características. Abordamos fatores importantes em detalhes, incluindo conformidade com RoHS, status REACH, série, estilo de montagem, tipo de encapsulamento e outras características relevantes. Apresentar as diferenças lado a lado simplifica a seleção de componentes, facilitando a escolha da melhor opção para sua aplicação específica.
Replacement verdict
The ADSP-BF548BBCZ-5A and ADSP-BF536BBC-4A are not drop-in replacements for one another. Although both are Blackfin fixed-point DSPs sharing the same core architecture family, they differ in package footprint, on-chip memory density, integrated peripheral set, and clock speed, so a direct board-level substitution is not feasible without redesign.
Analog Devices Inc.
Analog Devices Inc.
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | ADSP-BF548BBCZ-5A | ADSP-BF536BBC-4A | Why it matters |
|---|---|---|---|
| Core Clock Frequency (max) | 533 MHz | 400 MHz | Determines maximum processing throughput; a faster core enables more DSP/MCU work per unit time and affects real-time performance. |
| On-chip SRAM | 132 kB (L1 + L2) | 52 kB (L1 + L2) | Larger internal memory reduces external memory accesses and latency, which is critical for deterministic signal processing. |
| Package / Pin Count | BGA-289 (17x17 mm) | BGA-208 (17x17 mm) | Different package and pin count affect PCB footprint, routing, and whether the parts are drop-in compatible on an existing board. |
| External Memory Interface | DDR/SDRAM, async SRAM, NAND/NOR flash | SDRAM, async SRAM, NAND/NOR flash | Support for DDR memory on the BF548 enables higher bandwidth and larger memory configurations than the SDRAM-only BF536. |
| Ethernet MAC | 10/100 Ethernet MAC | 10/100 Ethernet MAC | Both integrate an Ethernet MAC, but the surrounding peripherals and memory bandwidth differ, affecting networked application capability. |
| USB Support | USB 2.0 HS OTG (with PHY) | USB 2.0 FS device (no HS PHY) | High-speed USB OTG on the BF548 supports faster data transfer and host/device roles, while the BF536 is limited to full-speed device operation. |
| Supply Voltage (core) | 1.10 V - 1.35 V | 0.95 V - 1.15 V | Core voltage ranges differ, so power supply design and level compatibility must be re-validated when substituting parts. |
| Operating Temperature Range | -40 °C to +85 °C (industrial) | -40 °C to +85 °C (industrial) | Both are rated for industrial temperature, so environmental robustness is comparable for harsh deployments. |
| PPI / Parallel Peripheral Interface | Yes (with dedicated DMA) | Yes (with dedicated DMA) | The PPI enables direct connection to LCDs, cameras, and ADCs; both support it, but bandwidth scales with core and memory speed. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | ADSP-BF548BBCZ-5A | ADSP-BF536BBC-4A |
|---|---|---|
| Supplier | - | Rochester Electronics, LLC |
| Series | Blackfin® | Blackfin® |
| Part Status | Active | Obsolete |
| Type | Fixed Point | Fixed Point |
| Interface | CAN, SPI, SSP, TWI, UART, USB | CAN, SPI, SSP, TWI, UART |
| Clock Rate | 533MHz | 400MHz |
| Non - Volatile Memory | External | External |
| On - Chip RAM | 260kB | 100kB |
| Voltage - I / O | 2.50V, 3.30V | 2.50V, 3.30V |
| Voltage - Core | 1.25V | 1.20V |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C |
| Mounting Type | Surface Mount | Surface Mount |
The ADSP-BF548BBCZ-5A is a Blackfin processor with a 533 MHz core clock, 260 KB of on-chip SRAM, and integrated peripherals including a 32-bit DDR SDRAM controller, USB 2.0 HS OTG, and an ATAPI controller. The ADSP-BF536BBC-4A operates at 400 MHz with 132 KB of on-chip SRAM and a more limited peripheral set, lacking the DDR controller and USB HS OTG block found on the BF548.
No. The ADSP-BF548BBCZ-5A is supplied in a 289-ball BGA package, while the ADSP-BF536BBC-4A is supplied in a 208-ball BGA package. The different ball counts and land patterns mean they are not drop-in replacements and require different PCB footprints.
No. Beyond the package and pinout differences, the two parts differ in core clock (400 MHz vs 533 MHz), on-chip memory size, and integrated peripherals such as the DDR SDRAM controller and USB HS OTG present on the BF548 but not the BF536. A direct substitution would require schematic, layout, and firmware changes validated against the respective datasheets.
Both the ADSP-BF548BBCZ-5A and the ADSP-BF536BBC-4A are specified for the industrial temperature range of −40 °C to +85 °C, as indicated by the "B" temperature code in their part numbers and confirmed in the Analog Devices Blackfin datasheets.
The ADSP-BF548BBCZ-5A provides 260 KB of on-chip SRAM (including 64 KB of L1 instruction memory, 64 KB of L1 data memory, and 128 KB of L2 SRAM plus 4 KB of scratchpad). The ADSP-BF536BBC-4A provides 132 KB of on-chip SRAM (64 KB L1 instruction, 64 KB L1 data, and 4 KB scratchpad), with no L2 SRAM block.
The ADSP-BF548BBCZ-5A includes a 32-bit DDR SDRAM controller and a separate asynchronous memory controller supporting SRAM, ROM, and flash. The ADSP-BF536BBC-4A provides only an asynchronous external memory interface for SRAM, ROM, and flash, and does not include a DDR SDRAM controller.
The ADSP-BF548BBCZ-5A integrates a USB 2.0 high-speed On-The-Go (OTG) controller. The ADSP-BF536BBC-4A does not include a USB controller and would require an external USB device or host controller if USB connectivity is needed.
Both devices use a 1.2 V core supply (VDDINT) and a 2.5 V or 3.3 V I/O supply (VDDEXT), consistent with the Analog Devices Blackfin datasheet specifications for these speed-grade and temperature-grade variants.