AM1808EZWTD4
Texas Instruments
- Lifecycle
- Active
- Stock
- 4891 PCS
- Package
- NFBGA-361
- Series
- Embedidos - Microprocessadores
Esta comparação detalhada entre AM1808EZWTD4 e AM1806BZCE3 fornece informações valiosas sobre suas especificações e principais características. Abordamos fatores importantes em detalhes, incluindo conformidade com RoHS, status REACH, série, estilo de montagem, tipo de encapsulamento e outras características relevantes. Apresentar as diferenças lado a lado simplifica a seleção de componentes, facilitando a escolha da melhor opção para sua aplicação específica.
Replacement verdict
The AM1808EZWTD4 and AM1806BZCE3 are both Sitara ARM9-based applications processors from Texas Instruments sharing the same AM18x family architecture, but they differ in core clock speed, on-chip memory, and operating temperature range. The AM1808EZWTD4 offers a higher 456 MHz core frequency and extended industrial temperature support, while the AM1806BZCE3 runs at 375 MHz with a narrower commercial temperature range. Functional substitution is feasible for lower-performance, temperature-tolerant designs, but validation of timing margins, memory requirements, and thermal conditions is required before committing to a drop-in replacement.
Texas Instruments
Texas Instruments
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | AM1808EZWTD4 | AM1806BZCE3 | Why it matters |
|---|---|---|---|
| Core Processor | ARM926EJ-S | ARM926EJ-S | Both use the same ARM926EJ-S core, so instruction set and software compatibility are preserved. |
| Max Clock Frequency | 456 MHz | 375 MHz | A higher maximum clock allows more processing throughput; a lower-rated part may not meet timing requirements of a design targeting the faster device. |
| Package / Case | 361-LFBGA (16x16) | 361-NFBGA (13x13) | Different package footprints and ball maps affect PCB layout and cannot be swapped without a board redesign. |
| Operating Temperature Range | -40°C to 90°C (TJ) | -40°C to 90°C (TJ) | Identical junction temperature ratings mean both suit the same thermal environments. |
| On-Chip RAM | 128 KB | 128 KB | Matching internal SRAM capacity supports the same buffer and scratchpad usage without external memory changes. |
| EMAC / Ethernet | 10/100 EMAC with MDIO | 10/100 EMAC with MDIO | Both integrate the same Ethernet MAC, so networking functionality is equivalent. |
| USB Ports | 2 (USB 2.0 OTG + Host) | 2 (USB 2.0 OTG + Host) | Identical USB capability preserves peripheral connectivity options. |
| LCD Controller | Integrated LCD controller | Integrated LCD controller | Both include an on-chip LCD controller, so display support is equivalent. |
| Supply Voltage (Core) | 1.2 V (1.14–1.32 V) | 1.2 V (1.14–1.32 V) | Same core voltage range means the same power supply design can be reused. |
| Product Status | Active | Active | Both are active parts, so long-term availability and lifecycle support are comparable. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | AM1808EZWTD4 | AM1806BZCE3 |
|---|---|---|
| Supplier | - | Rochester Electronics, LLC,Texas Instruments |
| Series | Sitara™ | Sitara™ |
| Part Status | Active | Obsolete |
| Core Processor | ARM926EJ-S | ARM926EJ-S |
| Number of Cores / Bus Width | 1 Core, 32-Bit | 1 Core, 32-Bit |
| Speed | 456MHz | 375MHz |
| Co - Processors / DSP | System Control; CP15 | System Control; CP15 |
| RAM Controllers | LPDDR, DDR2 | LPDDR, DDR2 |
| Graphics Acceleration | No | No |
| Display&Interface Controllers | LCD | LCD |
| USB | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | USB 2.0 + PHY (1) |
| Voltage - I / O | 1.8V, 3.3V | 1.8V, 3.3V |
| Operating Temperature | -40°C ~ 90°C (TJ) | 0°C ~ 90°C (TJ) |
| Ethernet | 10/100Mbps (1) | - |
| SATA | SATA 3Gbps (1) | - |
The AM1808EZWTD4 is an ARM926EJ-S based Sitara processor running at 456 MHz in a 361-ball NFBGA (ZWT) package, while the AM1806BZCE3 is an ARM926EJ-S based processor running at 375 MHz in a 361-ball NFBGA (ZCE) package. Both are members of the AM180x family but differ in maximum operating frequency, on-chip memory configuration, and peripheral set.
Both devices are offered in a 361-ball NFBGA package, but the package designators differ (ZWT for the AM1808EZWTD4 and ZCE for the AM1806BZCE3). Pinout and ball-map compatibility must be verified against the respective manufacturer datasheets before any board-level substitution is considered.
The AM1808EZWTD4 is specified for 456 MHz operation, while the AM1806BZCE3 is specified for 375 MHz operation. The frequency suffix in each part number reflects the rated maximum clock speed.
The AM1808EZWTD4 integrates on-chip ARM local RAM and shared RAM along with a larger peripheral set, whereas the AM1806BZCE3 provides a reduced on-chip memory configuration. Designers should consult the official AM180x datasheet for the exact RAM and ROM sizes of each variant.
No. The AM1808EZWTD4 includes additional peripherals such as an LCD controller and a SATA interface that are not present on the AM1806BZCE3. Both share common interfaces including USB, EMAC, McASP, SPI, I2C, and UART, but the exact feature mix must be confirmed from the manufacturer datasheet.
Not as a direct drop-in replacement. Differences in maximum frequency, on-chip memory, peripheral set, and package designator mean the replacement must be validated against the target design, including timing, power, and pin-function checks, using the official datasheets.
Both the AM1808EZWTD4 and AM1806BZCE3 are specified for the industrial temperature range of -40°C to 85°C (case temperature), as indicated by the temperature suffix in their part numbers. Confirm the exact thermal specification in the manufacturer datasheet.
The AM1808EZWTD4 offers a higher maximum operating frequency (456 MHz versus 375 MHz) and a richer peripheral set, making it the choice when additional processing headroom and interfaces such as LCD and SATA are required. Selection should still be validated against the application's power, thermal, and cost constraints.