AM5716AABCX
Texas Instruments
- Lifecycle
- Active
- Stock
- 6625 PCS
- Series
- Embedidos - Microprocessadores
Esta comparação detalhada entre AM5716AABCX e AM5718AZBOXEM fornece informações valiosas sobre suas especificações e principais características. Abordamos fatores importantes em detalhes, incluindo conformidade com RoHS, status REACH, série, estilo de montagem, tipo de encapsulamento e outras características relevantes. Apresentar as diferenças lado a lado simplifica a seleção de componentes, facilitando a escolha da melhor opção para sua aplicação específica.
Replacement verdict
The AM5718AZBOXEM is a viable functional replacement candidate for the AM5716AABCX within the Sitara AM57x family, sharing the same FCBGA package footprint and core architecture, though the higher-core-count AM5718AZBOXEM requires validation of power delivery, thermal budget, and pin-level configuration before adoption in an existing AM5716AABCX design.
Texas Instruments
Texas Instruments
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | AM5716AABCX | AM5718AZBOXEM | Why it matters |
|---|---|---|---|
| Arm CPU Cores | 1x Arm Cortex-A15 | 2x Arm Cortex-A15 | The number of Cortex-A15 cores determines general-purpose processing throughput; a dual-core device can run more concurrent application tasks than a single-core device. |
| DSP Cores | 2x C66x DSP | 2x C66x DSP | DSP cores handle real-time signal processing; matching DSP count supports similar deterministic signal-chain workloads. |
| Maximum Arm Clock Frequency | 1.5 GHz | 1.5 GHz | Clock frequency sets peak compute performance for the Cortex-A15 subsystem and affects timing margins in software. |
| Operating Temperature Range | 0°C to 90°C (commercial) | -40°C to 105°C (extended/industrial) | The temperature grade determines whether the part can be used in harsh or industrial environments; the extended-range part is required for wide-temperature applications. |
| Package Type | FCBGA (ABC) | FCBGA (ABZ) | Package footprint and ballout affect PCB layout and mechanical compatibility; different package codes may require board redesign. |
| Pin/Ball Count | 760 balls | 760 balls | Ball count influences routing density and board design; matching counts can simplify layout reuse. |
| Product Grade / Lifecycle | Catalog (standard) | Extended/EM grade | Grade designation affects qualification, reliability screening, and long-term availability for industrial or extended-life programs. |
| Integrated GPU | 2x SGX544 3D GPU | 2x SGX544 3D GPU | GPU presence enables graphics acceleration and offloads rendering tasks; matching GPU configuration supports similar HMI/graphics use cases. |
| Memory Interface | DDR3/DDR3L | DDR3/DDR3L | Supported memory type constrains board design and BOM choices; identical support allows reuse of memory subsystem design. |
| Core Voltage / Power Class | Standard voltage | Standard voltage | Voltage and power class affect thermal design and power budget; matching classes simplify power supply reuse. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | AM5716AABCX | AM5718AZBOXEM |
|---|---|---|
| Supplier | - | Texas Instruments |
| Series | Sitara™ | Sitara™ |
| Part Status | Active | Active |
| Core Processor | ARM® Cortex®-A15 | ARM® Cortex®-A15 |
| Number of Cores / Bus Width | 1 Core, 32-Bit | 1 Core, 32-Bit |
| Speed | 1.5GHz | 1.5GHz |
| Co - Processors / DSP | Multimedia; GPU, IPU, VFP | DSP, BB2D, IPU, IVA, GPU, VPE |
| RAM Controllers | DDR3, SRAM | DDR3, DDR3L |
| Graphics Acceleration | No | Yes |
| SATA | SATA 3Gbps (1) | SATA 3Gbps (1) |
| USB | USB 2.0 (1), USB 3.0 (1) | USB 2.0 (2), USB 3.0 (2) + PHY (2) |
| Voltage - I / O | 1.8V, 3.3V | 1.8V, 3.3V |
| Operating Temperature | 0°C ~ 90°C (TJ) | -55°C ~ 125°C |
| Base Product Number | AM5716 | - |
| Ethernet | 10/100/1000Mbps (1) | - |
| Mounting Type | Surface Mount | - |
| Additional Interfaces | CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | - |
| Packaging | Tray | - |
The AM5716AABCX is a Sitara AM5716 processor with a single-core Arm Cortex-A15 and dual-core C66x DSP, while the AM5718AZBOXEM is a Sitara AM5718 device featuring a dual-core Arm Cortex-A15 and dual-core C66x DSP. The AM5718AZBOXEM also includes an EM suffix indicating an extended temperature qualification, whereas the AM5716AABCX is specified for the standard industrial temperature range.
Both devices are offered in the same FCBGA (ABC) package with a 0.8 mm pitch and 760 balls, so they share a common package footprint. However, pin-to-pin compatibility must be confirmed against the respective datasheets because internal functional differences between the AM5716 and AM5718 may affect specific ball assignments.
The AM5716AABCX integrates one Arm Cortex-A15 core, while the AM5718AZBOXEM integrates two Arm Cortex-A15 cores. This affects symmetric multiprocessing capability and overall application processing throughput.
Yes. Both the AM5716AABCX and AM5718AZBOXEM include a dual-core C66x floating-point DSP subsystem, providing the same DSP processing resources for signal-processing workloads.
The EM suffix denotes an extended temperature grade device. The AM5718AZBOXEM is qualified for the extended industrial temperature range, whereas the AM5716AABCX is rated for the standard industrial temperature range. Designers should verify the exact junction temperature limits in the respective datasheets.
No. Although both share the same package, the AM5716AABCX has one Arm Cortex-A15 core versus two on the AM5718AZBOXEM, and it lacks the extended temperature qualification of the EM-suffixed part. A replacement requires validation of core count, thermal requirements, and any peripheral differences against the manufacturer datasheets.
Yes. Both the AM5716AABCX and AM5718AZBOXEM belong to the Texas Instruments Sitara AM57x family and are supported by the same Processor SDK, which includes Linux, RTOS, and DSP development toolchains. Software portability between the two is generally maintained, subject to core-count configuration.