C8051F850-C-GM vs C8051F330D

Esta comparação detalhada entre C8051F850-C-GM e C8051F330D fornece informações valiosas sobre suas especificações e principais características. Abordamos fatores importantes em detalhes, incluindo conformidade com RoHS, status REACH, série, estilo de montagem, tipo de encapsulamento e outras características relevantes. Apresentar as diferenças lado a lado simplifica a seleção de componentes, facilitando a escolha da melhor opção para sua aplicação específica.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification C8051F850-C-GM C8051F330D
Supplier - Silicon Labs
Series C8051F85x C8051F33x
Part Status Active Obsolete
Core Processor CIP-51™ 8051
Core Size 8-Bit 8-Bit
Speed 25MHz 25MHz
Connectivity I²C, SMBus, SPI, UART/USART SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT POR, PWM, Temp Sensor, WDT
Number of I/O 15 17
Program Memory Size 8KB (8K x 8) 8KB (8K x 8)
Program Memory Type FLASH FLASH
RAM Size 512 x 8 768 x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V 2.7V ~ 3.6V
Data Converters A/D 15x12b A/D 16x10b; D/A 1x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Through Hole
Compare RFQ