EPM2210F256C5N vs EPM2210F256C4

Esta comparação detalhada entre EPM2210F256C5N e EPM2210F256C4 fornece informações valiosas sobre suas especificações e principais características. Abordamos fatores importantes em detalhes, incluindo conformidade com RoHS, status REACH, série, estilo de montagem, tipo de encapsulamento e outras características relevantes. Apresentar as diferenças lado a lado simplifica a seleção de componentes, facilitando a escolha da melhor opção para sua aplicação específica.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

EPM2210F256C5N

Intel

Lifecycle: Active
Stock: 5038 PCS
Package: FBGA-256
Series: Embedded - CPLDs (Complex Programmable Logic Devices)

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Part B

EPM2210F256C4

Intel

Lifecycle: Active
Stock: 3083 PCS
Package: BGA-256
Series: Embedded - CPLDs (Complex Programmable Logic Devices)

+Lista de Materiais RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	EPM2210F256C5N	EPM2210F256C4
Supplier	-	Intel
Series	MAX® II	MAX® II
Part Status	Active	Active
Programmable Type	In System Programmable	In System Programmable
Delay Timetpd(1)Max	7 ns	7 ns
Voltage Supply - Internal	2.5V, 3.3V	2.5V, 3.3V
Number of Logic Elements/Blocks	2210	2210
Number of Macrocells	1700	1700
Number of I/O	204	204
Operating Temperature	0°C ~ 85°C (TJ)	0°C ~ 85°C (TJ)
Mounting Type	Surface Mount	Surface Mount

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