MC9S12E128CFUE vs MC9S12XDT512CAAR

Esta comparação detalhada entre MC9S12E128CFUE e MC9S12XDT512CAAR fornece informações valiosas sobre suas especificações e principais características. Abordamos fatores importantes em detalhes, incluindo conformidade com RoHS, status REACH, série, estilo de montagem, tipo de encapsulamento e outras características relevantes. Apresentar as diferenças lado a lado simplifica a seleção de componentes, facilitando a escolha da melhor opção para sua aplicação específica.

Technical review by ETEI Component Engineering Source: manufacturer documentation

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC9S12E128CFUE MC9S12XDT512CAAR
Supplier - NXP USA Inc.
Series HCS12 HCS12X
Part Status Active Obsolete
Core Processor HCS12 HCS12X
Core Size 16-Bit 16-Bit
Speed 25MHz 80MHz
Connectivity EBI/EMI, I2C, SCI, SPI CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 60 59
Program Memory Size 128KB (128K x 8) 512KB (512K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - 4K x 8
RAM Size 8K x 8 20K x 8
Voltage - Supply (Vcc/Vdd) 2.35V ~ 2.75V 2.35V ~ 5.5V
Data Converters A/D 16x10b; D/A 2x8b A/D 24x10b
Oscillator Type Internal External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Base Product Number MC9S12 -
Digi Key Programmable Not Verified -
Packaging Tray -
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