NCP1608BDR2G vs NCP1612ADR2G

Esta comparação detalhada entre NCP1608BDR2G e NCP1612ADR2G fornece informações valiosas sobre suas especificações e principais características. Abordamos fatores importantes em detalhes, incluindo conformidade com RoHS, status REACH, série, estilo de montagem, tipo de encapsulamento e outras características relevantes. Apresentar as diferenças lado a lado simplifica a seleção de componentes, facilitando a escolha da melhor opção para sua aplicação específica.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

NCP1608BDR2G

onsemi

Lifecycle: Active
Stock: 2805 PCS
Package: SOIC-8
Series: PMIC - PFC

+Lista de Materiais RFQ

Part B

NCP1612ADR2G

onsemi

Lifecycle: Active
Stock: 3808 PCS
Package: SOIC-10
Series: PMIC - PFC

+Lista de Materiais RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	NCP1608BDR2G	NCP1612ADR2G
Part Status	Active	Active
Mode	Critical Conduction (CRM)	Current Controlled Frequency Foldback (CCFF), Critical Conduction (CRM)
Current - Startup	24 µA	20 µA
Voltage - Supply	10.2V ~ 20V	9.5V ~ 35V
Operating Temperature	-40°C ~ 125°C	-40°C ~ 125°C
Mounting Type	Surface Mount	Surface Mount

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