XC3S1400A-4FTG256I vs XC3S1400A-4FGG484C

Esta comparação detalhada entre XC3S1400A-4FTG256I e XC3S1400A-4FGG484C fornece informações valiosas sobre suas especificações e principais características. Abordamos fatores importantes em detalhes, incluindo conformidade com RoHS, status REACH, série, estilo de montagem, tipo de encapsulamento e outras características relevantes. Apresentar as diferenças lado a lado simplifica a seleção de componentes, facilitando a escolha da melhor opção para sua aplicação específica.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

XC3S1400A-4FTG256I

AMD Xilinx

Lifecycle: Active
Stock: 2820 PCS
Package: BGA-256
Series: Embedded - FPGAs (Field Programmable Gate Array)

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Part B

XC3S1400A-4FGG484C

AMD Xilinx

Lifecycle: Active
Stock: 3341 PCS
Package: BGA-484
Series: Embedded - FPGAs (Field Programmable Gate Array)

+Lista de Materiais RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	XC3S1400A-4FTG256I	XC3S1400A-4FGG484C
Series	Spartan®-3A	Spartan®-3A
Part Status	Active	Active
Number of LABs/CLBs	2816	2816
Number of Logic Elements/Cells	25344	25344
Total RAM Bits	589824	589824
Number of I/O	161	375
Number of Gates	1400000	1400000
Voltage - Supply	1.14V ~ 1.26V	1.14V ~ 1.26V
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	-40°C ~ 100°C (TJ)	0°C ~ 85°C (TJ)

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