XC3S400A-4FGG400C vs XC3S400A-4FTG256I

Esta comparação detalhada entre XC3S400A-4FGG400C e XC3S400A-4FTG256I fornece informações valiosas sobre suas especificações e principais características. Abordamos fatores importantes em detalhes, incluindo conformidade com RoHS, status REACH, série, estilo de montagem, tipo de encapsulamento e outras características relevantes. Apresentar as diferenças lado a lado simplifica a seleção de componentes, facilitando a escolha da melhor opção para sua aplicação específica.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

XC3S400A-4FGG400C

AMD Xilinx

Lifecycle: Active
Stock: 5442 PCS
Package: FBGA-400
Series: Embedded - FPGAs (Field Programmable Gate Array)

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Part B

XC3S400A-4FTG256I

AMD Xilinx

Lifecycle: Active
Stock: 1829 PCS
Package: FBGA-256
Series: Embedded - FPGAs (Field Programmable Gate Array)

+Lista de Materiais RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	XC3S400A-4FGG400C	XC3S400A-4FTG256I
Series	Spartan®-3A	Spartan®-3A
Part Status	Active	Active
Number of LABs/CLBs	896	896
Number of Logic Elements/Cells	8064	8064
Total RAM Bits	368640	368640
Number of I/O	311	195
Number of Gates	400000	400000
Voltage - Supply	1.14V ~ 1.26V	1.14V ~ 1.26V
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	0°C ~ 85°C (TJ)	-40°C ~ 100°C (TJ)

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