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10AX016E3F29E2SG
+Lista de MateriaisIC FPGA 288 I/O 780FBGA
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FabricanteIntel
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Peça do Fabricante #10AX016E3F29E2SG
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Pacote FBGA-780
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Em Estoque2567
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Especificações
| Atributo | Valor |
| Package | Tray |
| Series | Arria 10 GX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 61510 |
| NumberofLogicElements/Cells | 160000 |
| TotalRAMBits | 10086400 |
| NumberofI/O | 288 |
| Voltage-Supply | 0.87V ~ 0.98V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 100°C (TJ) |
| Package/Case | 780-BBGA, FCBGA |
Visão Geral
Description
- 16K logic elements (LEs) for flexible digital design.
- Embedded memory (M20K blocks) and DSP blocks for high-performance processing.
- 29E2SG suffix indicates:
- 29: 0.9V core voltage variant.
- E2: Mid-range speed grade.
- SG: Industrial temperature range (-40°C to +100°C).
- Supports PCIe Gen3, DDR4, and high-speed transceivers (up to 17.4 Gbps).
Ideal for embedded systems, networking, and signal processing where reconfigurability and moderate logic density are needed.
Equivalent
- Xilinx Kintex UltraScale KU025 (similar performance, power)
- Lattice ECP5-85F (lower cost, smaller FPGAs)
- Microchip PolarFire MPF100T (mid-range, low power)
- Intel Cyclone 10 GX 10CX085 (lower-end alternative)
Check pin compatibility, features, and power requirements before substitution. For exact equivalents, consult Intel’s cross-reference or distributor databases.
Features
- FPGA Family: Arria 10 GX
- Logic Elements: 160K
- Transceivers: Up to 12.5 Gbps (16 full-duplex channels)
- Memory: 8.5 Mb embedded memory, DDR3/4 support
- DSP Blocks: 576 (18x19 multipliers)
- Process Technology: 20nm
- Power Efficiency: Enhanced with Core Fabric and HardCopy ASIC tech
- Package: 896-pin Flip-Chip BGA (29x29mm)
- I/O Standards: Supports LVDS, PCIe Gen1/2/3, and more
- Applications: High-speed networking, data centers, and signal processing.
This FPGA balances performance and power for mid-range applications.
Pinout
- Pin Count: 672 pins (29 x 29 mm package).
- Key Functions:
- Programmable logic (16K logic elements).
- High-speed transceivers (up to 12.5 Gbps).
- DDR3/4 memory interfaces.
- PCIe Gen3 support.
- General-purpose I/Os (GPIOs) with LVDS support.
- On-chip power management.
This FPGA is used in high-performance computing, networking, and embedded systems.