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10AX115H4F34E3SG
+Lista de MateriaisIC FPGA 504 I/O 1152FBGA
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FabricanteIntel
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Peça do Fabricante #10AX115H4F34E3SG
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Pacote BBGA-1152
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Em Estoque4025
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Arria 10 GX |
| Part Status | Active |
| Number of LABs/CLBs | 427200 |
| Number of Logic Elements/Cells | 1150000 |
| Total RAM Bits | 68857856 |
| Number of I/O | 504 |
| Voltage - Supply | 0.87V ~ 0.93V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
Visão Geral
Description
- 115K logic elements (LEs) for high-performance digital logic.
- GX variant with high-speed transceivers (up to 17.4 Gbps).
- 34 x 28.3 Gbps transceivers (H-tile) for high-bandwidth applications.
- FineLine BGA package (F34E3SG) with 1,518 pins.
- Supports DDR4, PCIe Gen3, and Ethernet protocols.
- Low-power 20nm process for efficiency.
Common uses: data centers, networking, signal processing, and high-performance computing.
For detailed specs, refer to Intel’s Arria 10 Device Handbook.
Equivalent
- 10AX115H4F34I3SG (Industrial temp range)
- 10AX115H4F34E3SG (Commercial temp range)
- Xilinx Kintex UltraScale KU115 (similar performance)
- Xilinx Virtex UltraScale VU9P (higher-end alternative)
Check datasheets for exact compatibility, as pinouts and features may vary.
Features
- Logic Elements: 115K
- Transceivers: Up to 96 full-duplex (up to 17.4 Gbps)
- Memory: 6,840 Kbits embedded memory (M20K)
- DSP Blocks: 1,518 (18x19 multipliers)
- Process Technology: 20nm
- Power Efficiency: Enhanced with hardened floating-point DSP
- Hard IP: PCIe Gen3, 10G Ethernet, and memory controllers
- Package: 1517-pin FCBGA (34x34mm)
- Operating Temperature: Commercial (0°C to 85°C)
Ideal for high-performance computing, networking, and signal processing.
Pinout
- Pin Count: 1,152 pins (34 x 34 mm F34 package, flip-chip BGA).
- Key Functions:
- High-performance FPGA with 115K logic elements (LEs).
- Supports PCIe Gen3, DDR4, 10G/40G Ethernet, and high-speed transceivers (up to 17.4 Gbps).
- Hard Processor System (HPS) optional (dual-core ARM Cortex-A9).
- 1.1V core voltage, industrial temperature range (-40°C to 100°C).
Used in networking, data centers, and high-speed signal processing.
Application
- High-performance computing (HPC)
- Data center acceleration (AI/ML, networking)
- 5G & wireless infrastructure
- Military/aerospace (radar, avionics)
- Industrial automation (real-time control)
- Medical imaging & diagnostics
- Automotive (ADAS, autonomous driving)
Its high-speed transceivers, DSP blocks, and power efficiency make it ideal for demanding, high-bandwidth applications.