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10M02SCE144I7G
+Lista de MateriaisIC FPGA 101 I/O 144EQFP
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FabricanteIntel
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Peça do Fabricante #10M02SCE144I7G
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Pacote EQFP-144
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | MAX® 10 |
| Part Status | Active |
| Number of LABs/CLBs | 125 |
| Number of Logic Elements/Cells | 2000 |
| Total RAM Bits | 110592 |
| Number of I/O | 101 |
| Voltage - Supply | 2.85V ~ 3.465V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Visão Geral
Description
For precise information, it is best to consult the manufacturer's datasheet or product documentation, as it will provide comprehensive details such as the component's capabilities, pin configuration, applications, and other essential specifications. This ensures proper understanding and correct usage in design or development projects.
Equivalent
Features
1. Logic Elements: It includes 2,000 Logic Elements (LEs), making it suitable for small to medium-sized designs.
2. Embedded Memory: The device incorporates embedded memory blocks to store data efficiently.
3. I/O Pins: It supports a variety of I/O standards with up to 101 available user I/O pins for external interfacing.
4. Integrated Flash: Unlike traditional FPGAs, MAX 10 devices have integrated flash, enabling them to be configured at power-up without external memory.
5. Single-Chip Solution: It offers a single-chip solution by integrating ADCs, temperature sensors, and flash memory.
6. Temperature and Voltage: Designed to operate in industrial temperature ranges and with multiple voltage options.
7. Package: Comes in an E144 package type, which refers to its specific physical and connectivity specifications.
These features make the 10M02SCE144I7G ideal for applications needing low power consumption and advanced functionality in a compact form.
Pinout
1. Logic Elements (LEs): The device integrates around 2,000 LEs for implementing digital logic.
2. Embedded Memory: It includes embedded memory blocks for efficient data storage and manipulation within the FPGA.
3. DSP Blocks: Basic DSP functionality is provided for arithmetic operations, useful in signal processing applications.
4. Analog-to-Digital Converter (ADC): The device includes ADC capabilities, allowing for interfacing with analog inputs.
5. Non-volatile Configuration Memory: It combines both SRAM-based logic and flash configuration, enabling instant-on functionality.
6. I/O Pins: The FPGA supports a wide range of I/O standards and features numerous general-purpose I/O pins for interfacing with other components.
The 10M02SCE144I7G is suitable for use in various applications, including industrial, automotive, and consumer electronics, thanks to its balance of performance, power efficiency, and cost-effectiveness.
Manufacturer
Application
1. Industrial Automation: Used in control systems and robotics for real-time processing.
2. Consumer Electronics: Powers smart devices and IoT applications.
3. Automotive Systems: Useful in infotainment systems and advanced driver assistance systems (ADAS).
4. Communication Systems: Supports signal processing and data management.
5. Medical Devices: Employed in diagnostic equipment and portable medical devices.
6. Security Systems: Utilized in surveillance and access control systems.
Its adaptability, combined with embedded flash memory, makes it suitable for designs requiring quick updates and reconfiguration.