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10M04DCU324C8G
+Lista de MateriaisIC FPGA 246 I/O 324UBGA
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FabricanteIntel
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Peça do Fabricante #10M04DCU324C8G
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Pacote 324-LFBGA
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Em Estoque7203
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Especificações
| Atributo | Valor |
| Package | Tray |
| Series | MAX® 10 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 250 |
| NumberofLogicElements/Cells | 4000 |
| TotalRAMBits | 193536 |
| NumberofI/O | 246 |
| Voltage-Supply | 1.15V ~ 1.25V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 324-LFBGA |
Visão Geral
Description
- Logic Elements: 4,000 (10K equivalent LUTs).
- Memory: 270 Kbits of embedded memory.
- I/O Pins: 324, supporting LVCMOS, LVDS, and other standards.
- Package: 324-pin UBGA (Ultra FineLine BGA).
- On-Chip Features: Dual-configuration flash, analog-to-digital converter (ADC), and PLLs.
- Process Technology: 55nm CMOS with embedded flash.
It is ideal for industrial control, automotive, and consumer electronics, offering instant-on operation, non-volatile configuration, and low power consumption. The C8G suffix indicates a commercial-grade device with a -8 speed grade.
For detailed specs, refer to Intel’s MAX 10 FPGA Device Overview documentation.
Features
- Logic Elements: 4,000 LEs
- Memory: 135 Kbits embedded RAM
- DSP Blocks: 12 (18x18 multipliers)
- I/O Pins: 324 (supports LVDS, LVCMOS)
- Flash Memory: 256 Kbits (user flash)
- ADC: 1 MSPS, 12-bit integrated ADC
- Clock Management: PLLs for flexible clocking
- Configuration: On-chip non-volatile flash, supports instant-on
- Package: 324-ball UBGA (8x8 mm)
- Operating Voltage: 1.2V core, 1.8V/2.5V/3.3V I/O
- Temperature Range: Commercial (0°C to 85°C)
Ideal for low-power, cost-sensitive applications like industrial control, IoT, and embedded systems.
Application
- Industrial Automation (motor control, PLCs)
- Embedded Systems (sensor interfacing, edge computing)
- Consumer Electronics (display controllers, IoT devices)
- Communications (protocol bridging, signal processing)
- Automotive (infotainment, ADAS peripherals)
Its compact size, flash-based configuration, and mixed-signal capabilities make it suitable for space-constrained, power-sensitive designs.