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10M08SAM153I7G
+Lista de MateriaisIC FPGA 112 I/O 153MBGA
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FabricanteIntel
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Peça do Fabricante #10M08SAM153I7G
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Pacote 153-VFBGA
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Especificações
| Atributo | Valor |
| Package | Tray |
| Series | MAX® 10 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 500 |
| NumberofLogicElements/Cells | 8000 |
| TotalRAMBits | 387072 |
| NumberofI/O | 112 |
| Voltage-Supply | 2.85V ~ 3.465V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 153-VFBGA |
Visão Geral
Description
Key features of the MAX 10 devices include:
1. Non-volatile Configuration Memory: They retain configuration after power cycling, eliminating the need for external configuration devices.
2. Embedded Flash: Provides on-chip storage for user data and configuration.
3. Mixed-Signal Capability: Includes analog-to-digital converters (ADCs) for applications requiring analog input.
4. Low Power Consumption: Suitable for power-sensitive applications.
5. Single-Chip Solution: Combines logic, storage, and processing capabilities in one package.
6. Versatile I/O Options: Supports a wide range of protocols and interfaces.
The "SAM153I7G" refers to specific package, temperature grade, and other variant-specific features, such as the UFBGA153 package type, industrial temperature range, and RoHS compliance.
Equivalent
Features
1. Non-volatile FPGA: Integrates flash memory for instant-on configuration.
2. Logic Elements (LEs): Contains 8,000 logic elements.
3. Integrated Analog-to-Digital Converter (ADC): Includes ADC functionality for analog signal processing.
4. Operating Temperature Range: Supports industrial temperature ranges.
5. Embedded Memory: Features on-chip memory storage capabilities.
6. General Purpose I/Os: Offers multiple I/O options for various interfacing needs.
7. Package Type: Available in a 153-pin Micro FineLine BGA package.
8. Power Management: Includes efficient power management features to reduce consumption.
9. Configuration Options: Provides flexible configuration options, including JTAG and internal configuration.
10. Development Support: Compatible with Intel's Quartus Prime software for design and development.
These features make it suitable for applications in industrial, automotive, and consumer electronics where reliable, low-power, instant-on FPGAs are necessary.
Pinout
1. Logic Elements (LEs): The FPGA contains 8,000 LEs, which are used to implement custom digital logic.
2. Memory Blocks: It includes embedded memory blocks to store data and facilitate efficient data processing.
3. Phase-Locked Loops (PLLs): These are used for clock management and to generate various clock frequencies from a single source.
4. Analog-to-Digital Converter (ADC): Some variations offer ADC functionality to interface with analog signals.
5. General Purpose I/Os: The device supports a variety of I/O standards, making it versatile for connecting with other digital components.
6. Embedded Multipliers: Useful for DSP applications, providing efficient multiply operations.
7. Configuration via Dual-Configuration Flash: Allows the FPGA to store multiple configuration files.
The 10M08SAM153I7G is suitable for a wide range of applications such as industrial, automotive, and consumer electronics due to its low power consumption and flexible design capabilities.
Manufacturer
Intel is one of the leading companies in the semiconductor industry, producing a wide range of products for various applications, including personal computers, servers, and embedded systems. The company is also involved in the development of technologies related to artificial intelligence, data centers, and the Internet of Things (IoT). Over the years, Intel has expanded its portfolio to include programmable solutions like FPGAs, which cater to diverse industries such as telecommunications, automotive, and industrial automation. The acquisition of Altera in 2015 significantly bolstered Intel's FPGA capabilities, integrating them into its existing product line and allowing the company to offer more comprehensive solutions to its customers.
Application
1. Industrial Automation: Controls and interfaces for machinery and processes.
2. Consumer Electronics: Custom logic and signal processing.
3. Automotive: Advanced driver-assistance systems (ADAS) and infotainment.
4. Communications: Signal processing and protocol bridging.
5. Medical Devices: Data acquisition and processing for diagnostic equipment.
6. IoT: Edge processing and connectivity solutions.
7. Aerospace and Defense: Secure communications and sensor interfacing.
These applications benefit from the device's non-volatile configuration, low power consumption, and integrated analog-to-digital converters.