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10M16DAF256I7G
+Lista de MateriaisIC FPGA 178 I/O 256FBGA
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FabricanteIntel
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Peça do Fabricante #10M16DAF256I7G
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Pacote BGA-256
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Em Estoque6815
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Especificações
| Atributo | Valor |
| Package | Tray |
| Series | MAX® 10 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1000 |
| NumberofLogicElements/Cells | 16000 |
| TotalRAMBits | 562176 |
| NumberofI/O | 178 |
| Voltage-Supply | 1.15V ~ 1.25V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 256-LBGA |
Visão Geral
Description
Key features of the 10M16DAF256I7G include embedded flash memory for configuration and user data storage, analog-to-digital converters (ADCs), and a variety of general-purpose input/output (GPIO) options. This FPGA supports diverse functions such as digital signal processing, control logic, and interface bridging. Its integration of flash memory enables single-chip solutions and simplifies board design, reducing the overall system cost. This model is suitable for industrial, automotive, and consumer applications that require efficient processing power within a compact footprint.
Equivalent
Features
1. Logic Elements: It offers around 16,000 logic elements, facilitating complex logic functions.
2. Memory: Includes embedded memory blocks for efficient data processing and storage.
3. DSP Blocks: Equipped with DSP (Digital Signal Processing) blocks for fast arithmetic operations, beneficial in signal processing applications.
4. I/O Options: Provides a range of I/O options, supporting various interfaces and standards for connectivity.
5. Non-Volatile Configuration: Features an on-chip flash memory for configuration, allowing instant-on functionality without the need for external configuration memory.
6. Embedded Processor Support: Supports soft processor IPs, enabling integration of custom processing cores.
7. Low Power: Designed for low power consumption, ideal for applications where energy efficiency is critical.
8. Temperature Range: Operates in industrial temperature ranges, suitable for harsh environments.
9. Package: Available in a 256-pin FBGA package, balancing size and pin count for diverse applications.
These features make the 10M16DAF256I7G suitable for applications like industrial automation, consumer electronics, and communications.
Pinout
Key functions and features include:
1. Logic Elements: It contains 16,000 logic elements, providing substantial processing capability.
2. Memory: Includes embedded memory blocks for efficient data storage and retrieval.
3. DSP Blocks: Equipped with DSP blocks for signal processing applications.
4. Non-Volatile Storage: Features on-chip flash for configuration memory, allowing instant-on capability.
5. I/O Pins: Provides multiple I/O pins for versatile interfacing options.
6. Analog Features: Includes analog-to-digital converters (ADCs) for mixed-signal applications.
7. Integrated Phase-Locked Loops (PLLs): For clock management and signal synchronization.
This device is suitable for a wide range of applications, including communications, industrial, and automotive systems, due to its integration of logic, memory, and analog components.
Manufacturer
Application
1. Industrial Automation: For control systems, sensor data processing, and interface bridging.
2. Consumer Electronics: Used in devices requiring customizable logic.
3. Communications: Employed in protocol bridging, data buffering, and custom interface solutions.
4. Automotive: Used for infotainment systems, advanced driver-assistance systems (ADAS), and vehicle networking.
5. Medical Devices: Provides flexibility in imaging systems and portable medical equipment.
6. Aerospace and Defense: Suitable for signal processing, avionics, and secure communications.
Its low power consumption, integrated flash, and cost-effectiveness make it versatile for these applications.