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10M25DAF256I7G
+Lista de MateriaisIC FPGA 178 I/O 256FBGA
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FabricanteIntel
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Peça do Fabricante #10M25DAF256I7G
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Pacote LBGA-256
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Em Estoque4600
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Especificações
| Atributo | Valor |
| Package | Tray |
| Series | MAX® 10 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1563 |
| NumberofLogicElements/Cells | 25000 |
| TotalRAMBits | 691200 |
| NumberofI/O | 178 |
| Voltage-Supply | 1.15V ~ 1.25V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 256-LBGA |
Visão Geral
Description
The MAX 10 series is built on a non-volatile flash-based architecture, allowing instant-on functionality, which is ideal for reducing startup times. It also offers integrated analog-to-digital converters (ADCs), enhancing its ability to process analog signals directly on-chip, making it suitable for mixed-signal applications.
The device is optimized for low power consumption while providing high performance, making it suitable for industrial, automotive, and consumer electronics applications. With its enhanced I/O capabilities and flexible configuration options, the 10M25DAF256I7G supports various interfaces and protocols, serving as a versatile solution for developers seeking efficient design implementation.
Equivalent
Features
1. FPGA Logic Elements: Contains 25,000 logic elements (LEs) which provide a balance of logic and routing resources.
2. Embedded Memory: Up to 1,278 Kb of embedded memory blocks for data storage and processing.
3. I/O Pins: Offers 178 user I/O pins, facilitating connectivity with other devices.
4. On-chip Flash: Includes integrated dual-configuration flash memory for reliable and easy configuration.
5. Analog Features: Incorporates ADC blocks for integration with analog signals, supporting up to 154.91 K samples per second.
6. Embedded Processing: Supports Nios II soft processor for embedded processing applications.
7. Temperature Grade: Industrial grade, suitable for a temperature range of -40°C to +100°C.
8. Package: Housed in a 256-pin FineLine BGA (Ball Grid Array) package for compact deployments.
9. Power Management: Features power-on reset and internal oscillator, assisting in efficient power management and reducing external component requirements.
These features make it suitable for a wide range of applications in consumer, industrial, and automotive markets.
Pinout
The primary functions of this FPGA include digital logic capabilities, basic embedded processing, and the support for various I/O standards. It integrates non-volatile flash with the FPGA fabric, allowing for instant-on functionality and configuration memory. The device supports a variety of interfaces and protocols, including LVDS, PCI Express, and others depending on the specific design implementation. Additionally, it includes features like analog-to-digital converters (ADCs), phase-locked loops (PLLs), and embedded memory blocks, making it suitable for diverse applications in industrial, automotive, and consumer electronics.
For precise pin functions and configuration, refer to the device datasheet and technical reference manual, as the pin assignment can vary depending on the intended use and configuration of the FPGA.