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10M50SAE144C8G
+Lista de MateriaisIC FPGA 101 I/O 144EQFP
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FabricanteIntel
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Peça do Fabricante #10M50SAE144C8G
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Pacote 144-LQFP
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Em Estoque6416
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Especificações
| Atributo | Valor |
| Package | Tray |
| Series | MAX® 10 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 3125 |
| NumberofLogicElements/Cells | 50000 |
| TotalRAMBits | 1677312 |
| NumberofI/O | 101 |
| Voltage-Supply | 2.85V ~ 3.465V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 144-LQFP Exposed Pad |
Visão Geral
Description
The devices in this series support a wide range of I/O standards and include advanced security features, such as hardware-based encryption, to protect the intellectual property. They are often used in industrial, automotive, and consumer electronics markets for tasks such as signal processing, data conversion, and control applications. With its combination of flexibility, performance, and low power consumption, the 10M50SAE144C8G is a versatile option for designers seeking efficient solutions for complex designs.
Equivalent
Features
1. Logic Elements: It comprises 50,000 logic elements, providing significant logic density for complex designs.
2. Embedded Memory: It includes up to 1,677 Kbits of embedded memory for efficient data processing and storage.
3. Integrated Flash: The device features on-chip flash storage for configuration data, eliminating the need for external configuration memory.
4. Analog-to-Digital Converter (ADC): The FPGA incorporates ADCs to facilitate analog signal processing.
5. Clock Management: It provides flexible clock management with PLLs (Phase-Locked Loops) for various timing needs.
6. I/O Options: The device supports a variety of I/O standards, enhancing its connectivity with other components.
7. Package: Available in a 144-pin EQFP (Exposed Quad Flat Pack) package, suitable for compact designs.
8. Low Power: Built on a low-power process technology, making it suitable for power-sensitive applications.
These features make the 10M50SAE144C8G suitable for applications in industrial, automotive, and consumer electronics where flexibility and performance are critical.
Pinout
1. Logic Elements: It contains 50,000 logic elements, suitable for a range of digital logic applications.
2. Embedded Memory: It includes embedded memory blocks for data storage and processing.
3. DSP Blocks: There are integrated DSP blocks for signal processing tasks.
4. Internal Flash: On-chip flash memory is available for configuration storage, eliminating the need for external configuration memory.
5. High-Speed I/O: Offers a range of I/O standards and high-speed I/O interfaces.
6. PLL: Phase-locked loops for clock management and signal conditioning.
7. Dual-Configuration Flash: Supports dual boot images for additional functionality and redundancy.
The 10M50SAE144C8G is versatile, supporting various applications from industrial to consumer electronics, due to its combination of logic resources, embedded memory, and DSP capabilities.