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1SG280HU2F50E2VG
+Lista de MateriaisIC FPGA 704 I/O 2397BGA
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FabricanteIntel
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Peça do Fabricante #1SG280HU2F50E2VG
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Pacote FBGA-2397
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Em Estoque1912
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Especificações
| Atributo | Valor |
| Package | Tray |
| Series | Stratix® 10 GX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 350000 |
| NumberofLogicElements/Cells | 2800000 |
| NumberofI/O | 704 |
| Voltage-Supply | 0.77V ~ 0.97V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 100°C (TJ) |
| Package/Case | 2397-BBGA, FCBGA |
Visão Geral
Description
To understand it fully, one would need to consult the manufacturer's documentation or product catalog where this identifier is used. This information would typically include details about the product's capabilities, applications, and any relevant technical parameters. It might be linked to sectors such as semiconductors, hardware manufacturing, or industrial equipment, where model numbers convey essential details about compatibility and performance.
For precise information, it's advisable to check the manufacturer's website, product datasheets, or contact customer support. These resources usually offer comprehensive insights into the product's use cases, specifications, and relevant technological details.
Equivalent
Features
1. Advanced Process Technology: Manufactured using Intel’s 14nm Tri-Gate process technology, offering enhanced performance and power efficiency.
2. High-Performance Architecture: Designed for demanding applications with high-speed transceivers, extensive I/O capabilities, and a large number of logic elements.
3. Adaptive Logic Modules: Provide flexibility and power efficiency, allowing for customizable digital circuit creation.
4. High-Speed Transceivers: Support for high-bandwidth communication protocols, suitable for data-intensive applications.
5. Heterogeneous 3D System-in-Package: Integration of different types of chips, such as memory and processors, for enhanced functionality.
6. Security Features: Advanced encryption and authentication capabilities for secure data handling.
7. Embedded Processors: Some models include embedded ARM processors for increased processing capability.
For accurate specifications, consulting the official Intel documentation and datasheets is recommended.
Manufacturer
Application
1. Data Centers: Accelerating data processing and enabling efficient data management.
2. Telecommunications: Supporting high-speed data transfer and network infrastructure.
3. Broadcast and Pro AV: Enhancing video processing and broadcasting capabilities.
4. Military and Aerospace: Providing robust solutions for signal processing and secure communications.
5. High-Performance Computing: Facilitating complex computations and simulations.
6. Financial Services: Speeding up algorithmic trading and risk analysis.
These FPGAs offer high-speed processing, flexibility, and scalability, making them suitable for demanding applications.