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5SGXMA3H2F35C3G
+Lista de MateriaisIC FPGA 600 I/O 1152FBGA
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FabricanteIntel
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Peça do Fabricante #5SGXMA3H2F35C3G
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Pacote BBGA-1152
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Em Estoque6826
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | Stratix® V GX |
| Part Status | Active |
| Number of LABs/CLBs | 128300 |
| Number of Logic Elements/Cells | 340000 |
| Total RAM Bits | 19456000 |
| Number of I/O | 600 |
| Voltage - Supply | 0.82V ~ 0.88V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Visão Geral
Description
Key features include a large number of logic elements, high-speed transceivers, and substantial on-chip memory. The Stratix V family supports various protocols and standards, providing flexibility and adaptability for diverse applications. The 5SGXMA3H2F35C3G model offers a balance of power and performance, enabling designers to implement complex algorithms and systems. Additionally, it supports various development tools and workflows provided by Intel, facilitating efficient design and implementation processes.
In summary, the 5SGXMA3H2F35C3G FPGA is a powerful component for engineers looking to implement high-performance, adaptable solutions in advanced digital systems.
Equivalent
Features
1. Architecture: Stratix V FPGAs are based on a 28 nm process technology, offering high performance and low power consumption.
2. Logic Elements: These FPGAs have a high number of adaptive logic modules, enhancing processing capability.
3. Transceivers: They support multiple high-speed transceivers, suitable for applications requiring rapid data transfer.
4. Memory: Includes embedded memory blocks for efficient data storage and processing.
5. DSP Blocks: Integrated DSP blocks allow for high-speed digital signal processing, beneficial for applications like video and image processing.
6. I/O Flexibility: Provides numerous I/O options for versatile connectivity.
7. PCI Express: Built-in support for PCIe, facilitating integration with other hardware systems.
8. Power Efficiency: Designed with power optimization features to reduce operational costs.
These features make the 5SGXMA3H2F35C3G suitable for high-performance applications in telecommunications, military, and data center operations.
Pinout
The functions of the pins on this FPGA include:
1. Power and Ground Pins: These are used to supply power to the FPGA and provide a ground reference.
2. I/O Pins: These are used for general-purpose input and output. They are configurable and can support various I/O standards.
3. Dedicated Transceiver Pins: These are used for high-speed serial data transmission, supporting protocols like PCI Express, Ethernet, and others.
4. Configuration Pins: These are used to configure the FPGA at startup.
5. Clock and Control Pins: These manage clock input and control signals for synchronizing operations within the device.
Overall, the 5SGXMA3H2F35C3G is designed for high-throughput, low-latency applications in fields such as telecommunications, data centers, and video processing.
Manufacturer
Intel Corporation is a multinational technology company headquartered in Santa Clara, California. It is one of the world's largest and most well-known manufacturers of semiconductor chips. Intel develops a wide range of products, including processors for personal computers, servers, and other devices, as well as memory and storage solutions, programmable semiconductors like FPGAs, and various other hardware components. The company plays a critical role in the computing and technology industries, providing the foundational technology for a wide array of computing devices and systems.
Application
1. Telecommunications: Used in base stations and network infrastructure for signal processing.
2. Data Centers: Supports high-speed data processing and network functions.
3. Aerospace and Defense: Provides reliable and customizable solutions for complex computations.
4. Medical Imaging: Enhances processing speed and image quality.
5. Broadcasting: Facilitates video processing and transmission.
6. Industrial Automation: Supports real-time processing for sophisticated control systems.
These applications benefit from the chip's flexibility, reconfigurability, and performance capabilities.