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74LCX245MTCX
+Lista de MateriaisIC TXRX NON-INVERT 3.6V 20TSSOP
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Fabricanteonsemi
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Peça do Fabricante #74LCX245MTCX
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Ficha Técnica 74LCX245MTCX DataSheet
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Pacote 20-TSSOP
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Especificações
| Atributo | Valor |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Series | 74LCX |
| ProductStatus | Active |
| LogicType | Transceiver, Non-Inverting |
| NumberofElements | 1 |
| NumberofBitsperElement | 8 |
| OutputType | 3-State |
| Current-OutputHighLow | 24mA, 24mA |
| Voltage-Supply | 2V ~ 3.6V |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 20-TSSOP (0.173, 4.40mm Width) |
Visão Geral
Description
Equivalent
Features
Key features include:
- Low power consumption due to its CMOS technology.
- High-speed performance with typical propagation delays of 5.2 ns.
- Outputs can drive up to 24 mA at 3.0V, providing strong drive capability.
- The device has a power-down protection feature on inputs and outputs.
- It operates in both forward and reverse data transmission modes.
- The 3-state outputs are useful for bus-oriented applications.
- It is available in a TSSOP package, which is compact and suitable for space-constrained applications.
These characteristics make the 74LCX245MTCX suitable for a wide range of digital applications that require high-speed data transfer and bidirectional communication.
Pinout
1. A1-A8 (Pins 2-9): Data Inputs/Outputs for side A.
2. B1-B8 (Pins 18-11): Data Inputs/Outputs for side B.
3. DIR (Pin 1): Direction control input. When high, data flows from A to B; when low, from B to A.
4. OE (Pin 19): Output enable input. When high, the outputs are in high-impedance state; when low, the outputs are enabled.
5. VCC (Pin 20): Power supply pin.
6. GND (Pin 10): Ground pin.
The 74LCX245MTCX operates with a supply voltage range of 2.0V to 3.6V and is commonly used in applications where bi-directional data flow is required, such as in memory interfacing or bus-oriented systems.
Manufacturer
Application
1. Microcontroller and Microprocessor Interfaces: Facilitates communication between different voltage-level logic devices.
2. Memory Interfacing: Connects memory units with different voltage requirements to the main system board.
3. Peripheral Device Communication: Interfaces peripherals like sensors and displays with a central processor.
4. Data Communication Systems: Used in networking for signal buffering and bidirectional data transfer.
5. Consumer Electronics: Implements data transfer in devices like computers and gaming consoles.
6. Industrial Automation: Supports communication in control and automation systems.
Its low power consumption and high-speed operation make it ideal for modern, high-performance applications.