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74LVC125APW
+Lista de MateriaisBuffers & Line Drivers QUAD BUFF/DRVR 3ST 3.3V
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Peça do Fabricante #74LVC125APW
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Especificações
| Atributo | Valor |
| StandardPackQty | 96 |
Visão Geral
Description
Key features include high-speed operation, low power consumption, and the ability to handle inputs up to 5.5V regardless of the supply voltage, making it suitable for mixed-voltage systems. The 74LVC125APW is typically packaged in TSSOP (Thin Shrink Small Outline Package) configuration, making it compact and suitable for space-constrained designs. Its robust design ensures reliable performance, which is crucial in applications like communications, computing, and consumer electronics.
Equivalent
1. SN74LVC125APWR from Texas Instruments
2. MC74LCX125 from ON Semiconductor
3. 74VHC125 from Toshiba
4. CD74ACT125 from Texas Instruments
5. SN74AHC125 from Texas Instruments
These parts perform similar buffering functions with 3-state outputs and are suitable for similar voltage levels and logic families. Always verify datasheets for specific compatibility.
Features
1. Wide Operating Voltage Range: Operates from 1.2V to 3.6V, making it suitable for various low power applications.
2. High-Speed Operation: Designed for high-speed data transmission with minimal propagation delay.
3. 3-State Outputs: The outputs can be set to high, low, or high-impedance state, allowing for more flexibility in circuit designs.
4. Low Power Consumption: Consumes minimal power in both active and idle states, which is ideal for battery-powered devices.
5. Overvoltage Tolerant Inputs: Input pins are tolerant up to 5.5V, regardless of the VCC, allowing interfacing with 5V logic.
6. Latch-Up Performance: Meets JESD 78 Class II standards, ensuring robustness against latch-up.
7. Package Options: Available in TSSOP (Thin Shrink Small Outline Package), which is space-efficient for compact designs.
These features make the 74LVC125APW suitable for use in consumer electronics, computing, and communication devices.
Pinout
The 74LVC125APW comes in a TSSOP (Thin Shrink Small Outline Package) with 14 pins. The pin configuration is typically as follows:
1. 1OE - Output Enable for buffer 1
2. 1A - Input for buffer 1
3. 1Y - Output for buffer 1
4. 2OE - Output Enable for buffer 2
5. 2A - Input for buffer 2
6. 2Y - Output for buffer 2
7. GND - Ground
8. 3Y - Output for buffer 3
9. 3A - Input for buffer 3
10. 3OE - Output Enable for buffer 3
11. 4Y - Output for buffer 4
12. 4A - Input for buffer 4
13. 4OE - Output Enable for buffer 4
14. VCC - Supply Voltage
The 3-state outputs are controlled by the OE (Output Enable) pins, allowing for easy connection to shared data buses.
Manufacturer
Application
1. Signal Buffering: Enhances signal integrity and drives capacitive loads with minimal delay.
2. Bus Interface: Facilitates communication between components in microcontroller and microprocessor systems.
3. Logic Level Translation: Converts signal levels between different parts of a system.
4. Data Multiplexing/Demultiplexing: Enables efficient data routing.
5. Digital Circuitry: Useful in building digital circuits where control of data flow is required.
These features make it suitable for consumer electronics, computing, and telecommunication devices.