APA300-FG144I

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APA300-FG144I

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IC FPGA 100 I/O 144FBGA

  • FabricanteTecnologia Microchip

  • Peça do Fabricante #APA300-FG144I

  • Pacote LFBGA-144

  • Em Estoque1441

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Especificações

Atributo Valor
Package / Case Tray
Series ProASICPLUS
Part Status Active
Total RAM Bits 73728
Number of I/O 100
Number of Gates 300000
Voltage - Supply 2.3V ~ 2.7V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C (TA)

Visão Geral

Description

The APA300-FG144I is a Field-Programmable Gate Array (FPGA) from Microsemi (now Microchip) under the ProASIC3 family. Key features:
- Low-power, flash-based FPGA with 300K system gates.
- 144-pin Fine-Pitch Ball Grid Array (FG144) package.
- Non-volatile, secure, and instant-on operation.
- Supports 1.5V core voltage with 3.3V/2.5V I/O options.
- Includes embedded RAM, PLLs, and high-performance I/O.
Applications: Industrial control, communications, defense, and embedded systems.
For detailed specs, refer to Microchip’s ProASIC3 datasheet.

Equivalent

The APA300-FG144I (Actel ProASIC3 FPGA) has several equivalents:
- Microsemi (formerly Actel) ProASIC3 family (e.g., APA150, APA600)
- Lattice Semiconductor MachXO2/3 (lower-cost alternatives)
- Xilinx Spartan-3/6 (similar FPGAs, though not pin-compatible)
- Altera (Intel) Cyclone III/IV (comparable in features)
Check pin compatibility and features before substitution.

Features

The APA300-FG144I is a high-performance FPGA from Microsemi (now Microchip), featuring:
- 300K System Gates: Suitable for medium-complexity designs.
- 144-Pin Fine-Pitch BGA (FG144): Compact footprint for space-constrained applications.
- Low Power: Optimized for power-sensitive designs.
- High Reliability: Military-grade (optional) and industrial temperature support (-40°C to +100°C).
- On-Chip Memory: Up to 54 Kbits of RAM.
- High-Speed I/O: Supports LVCMOS, LVTTL, and other standards.
- Security: Flash-based, immune to configuration bitstream theft.
- Design Flexibility: Supports Libero IDE for development.
Ideal for aerospace, defense, and industrial applications.

Pinout

The APA300-FG144I is a member of the ProASIC3 FPGA family from Microsemi (now Microchip).
- Pin Count: 144 pins (FG144 package)
- Key Functions:
- I/O Pins: 108 user I/O pins (supports 3.3V, 2.5V, 1.8V, 1.5V)
- Power Pins: VCC (core), VCCIO (I/O banks), GND
- Configuration Pins: JTAG (TMS, TCK, TDI, TDO), FlashROM interface
- Clock Pins: Dedicated clock inputs (e.g., PLL-related)
- Special Pins: Analog (VREF, ADC), programming (nINIT, nCS)
This FPGA features 300K system gates, embedded Flash, and supports high-performance logic integration.

Manufacturer

The APA300-FG144I is a field-programmable gate array (FPGA) manufactured by Microsemi (now part of Microchip Technology). Microsemi was a leading provider of semiconductor solutions, specializing in high-reliability, radiation-tolerant, and low-power FPGAs, ASICs, and other components for aerospace, defense, industrial, and communications applications.
Microchip Technology acquired Microsemi in 2018, integrating its products into its portfolio while maintaining support for existing designs. The APA300-FG144I is part of Microsemi’s ProASIC3 FPGA family, known for its non-volatile flash-based technology, security features, and low power consumption.
Microchip is a major U.S.-based semiconductor company focused on microcontrollers, analog, and FPGA solutions for embedded systems.

Application

The APA300-FG144I, a field-programmable gate array (FPGA) from Microsemi (now Microchip), is used in:
- Embedded Systems: Custom logic for industrial control, automation.
- Communications: Signal processing, protocol bridging.
- Aerospace & Defense: Radiation-tolerant applications.
- Medical Devices: Real-time data processing.
- IoT & Edge Computing: Low-power, high-performance processing.
Its low power consumption, reconfigurability, and 144-pin FineLine BGA package make it suitable for compact, power-sensitive designs.

Package

The APA300-FG144I is a Field-Programmable Gate Array (FPGA) from Microsemi (now Microchip). It comes in a 144-pin Fine-Pitch Ball Grid Array (FBGA) package (FG144). This package type is compact, surface-mounted, and designed for high-density applications, offering reliable performance in space-constrained designs. The "FG" denotes Fine-Pitch BGA with a 1.0mm ball pitch.

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