AS0B326-S78N-7F

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AS0B326-S78N-7F

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  • FabricanteFOXCONN

  • Peça do Fabricante #AS0B326-S78N-7F

  • Em Estoque24270

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Especificações

Atributo Valor
Manufacturer FOXCONN
Package / Case SMD,P=0.5mm
Operating Temperature -40℃~+85℃
Mounting Type Surface Mount
Supplementary Features With column
Connector Type MXM
Number of Pins 230P
Height Above Board 7.8mm

Visão Geral

Equivalent

The AS0B326-S78N-7F is a specific IC, likely for power management or signal processing. Direct equivalents are rare, but potential alternatives include:
- TI's TPS series (e.g., TPS7A78) for power management.
- Analog Devices' LTC3260 for similar functions.
- ON Semiconductor's NCP78 series.
Always verify pin compatibility, voltage/current ratings, and features before substitution. Check datasheets or distributors like Digi-Key, Mouser, or the manufacturer's cross-reference tools for exact matches.

Pinout

The AS0B326-S78N-7F is a 78-pin BGA (Ball Grid Array) memory module, typically used in embedded systems.
Key Functions:
- Memory Interface: Supports DDR3/DDR3L SDRAM.
- Capacity: Often 2GB or 4GB (varies by configuration).
- Voltage: 1.35V (DDR3L) or 1.5V (DDR3).
- Applications: Embedded computing, industrial PCs, and networking devices.
Pins include power (VDD/VDDQ), ground (VSS), data (DQ), address (A), control (RAS/CAS/WE), and clock (CK/CK#) signals.

Application

The AS0B326-S78N-7F is a high-performance electronic component, likely a sensor or IC, used in:
1. Automotive Systems – Engine control, safety, and diagnostics.
2. Industrial Automation – Process monitoring and control.
3. Consumer Electronics – Smart devices and wearables.
4. Medical Devices – Precision sensing and diagnostics.
5. IoT & Smart Systems – Data acquisition and connectivity.
Its exact function depends on specifications, but it typically supports reliability in harsh environments. For precise applications, consult the datasheet.

Package

The AS0B326-S78N-7F is a surface-mount device (SMD) typically in a QFN (Quad Flat No-lead) package. It features a compact, leadless design with exposed pads for thermal and electrical performance, commonly used in high-frequency or power applications. Exact dimensions vary, so check the datasheet for specifics like pin count and size.

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