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BCM53158XMB1KFBG
+Lista de MateriaisIC ETHERNET SWITCH GPIO
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FabricanteBroadcom Limited
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Peça do Fabricante #BCM53158XMB1KFBG
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Pacote FBGA-311
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Em Estoque3547
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Especificações
| Atributo | Valor |
| Package / Case | Tray |
| Series | RoboSwitch™ |
| Part Status | Active |
| Protocol | Ethernet |
| Function | Switch |
| Interface | GPIO, I²C, MII, SPI |
| Standards | IEEE 802.3, 10/100/1000 Base-T/TX PHY |
| Operating Temperature | 0°C ~ 70°C |
Visão Geral
Description
Equivalent
Features
1. High Performance: It is equipped with multiple Ethernet ports, supporting up to Gigabit speeds, providing high-speed data transfer capabilities.
2. Energy Efficiency: Incorporates energy-efficient Ethernet features to reduce power consumption, making it suitable for environmentally conscious deployment.
3. Advanced Security: Offers enhanced security features, including support for IEEE 802.1AE MACsec for secure communication, ensuring data integrity and confidentiality.
4. Quality of Service (QoS): Supports advanced QoS features which allow for traffic prioritization, ensuring bandwidth allocation for critical applications.
5. VLAN Support: Includes VLAN capabilities for network segmentation, enhancing security and management.
6. Management and Configuration: Provides extensive management interfaces and protocols, such as SNMP, for easy network management and configuration.
7. Flexibility: Compatible with various network topologies and can be integrated into a wide range of networking environments from enterprise to service provider networks.
Overall, the BCM53158XMB1KFBG is designed for robust, secure, and efficient network switching solutions.
Pinout
The specific chip, BCM53158XMB1KFBG, typically has 196 pins. It is packaged in a Fine-Pitch Ball Grid Array (FBGA), which facilitates high-density connections and is suitable for compact designs.
Functionally, the BCM53158 is designed to manage Ethernet traffic efficiently. It supports various features such as VLANs, quality of service (QoS), and multicast capabilities, making it suitable for enterprise and consumer networking equipment. The chip handles Layer 2 switching and may include additional functionalities such as Layer 3 routing, depending on the implementation.
These chips are widely used in designing network switches, routers, and other networking devices where reliable and efficient data traffic management is required.
Manufacturer
Broadcom’s product portfolio includes data center networking, home connectivity, broadband access, telecommunications equipment, smartphones, and base stations, along with industrial solutions such as factory automation, power generation, and alternative energy systems. The company is known for its innovations in semiconductor technology, offering solutions that are integral to modern digital infrastructure and connected devices, including chips used in networking, storage, and wireless communication. Broadcom operates internationally, serving a wide range of industries and sectors, providing critical technology components that enable next-generation communications and access to information.