BCM56170B0IFSBG

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BCM56170B0IFSBG

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24X10G L3 TSN SWITCH

  • FabricanteBroadcom Limited

  • Peça do Fabricante #BCM56170B0IFSBG

  • Em Estoque3331

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Description

The BCM56170B0IFSBG is a Broadcom network switch integrated circuit from the StrataXGS product line. It is designed to deliver high-performance, feature-rich Ethernet switching capabilities, suitable for enterprise and data center applications. The BCM56170 series supports multi-layer switching functions, including layer 2 and layer 3 protocols, and is optimized for low power consumption and efficient thermal management.
This IC offers a variety of port configurations, typically supporting multiple 1G to 10G Ethernet interfaces, which makes it versatile for different networking requirements. It also includes advanced features such as VLAN support, Quality of Service (QoS), security protocols, and traffic management tools.
Furthermore, the BCM56170 series is equipped with Broadcom's robust software development kit (SDK), enabling easy integration and management within existing network infrastructures. The device is designed to help network operators optimize performance and scalability, making it a suitable choice for building reliable and high-speed network solutions.

Equivalent

The BCM56170B0IFSBG is a Broadcom Ethernet switch chip designed for enterprise and data center applications. Equivalent products are those with similar functionality and specifications from other manufacturers. Possible equivalents include:
1. Cisco's Catalyst series switch ASICs.
2. Marvell's Prestera switch series.
3. Intel's (formerly Altera) Ethernet switch solutions.
4. Microchip’s VSC series.
The exact equivalent depends on specific use-case requirements like port count, speed, and architecture. Always consult technical specifications for precise matching.

Features

The BCM56170B0IFSBG is a member of Broadcom's StrataXGS® family, designed for Ethernet switching applications. Key features include:
1. High-Performance Switching: It supports up to 28 GE ports with integrated PHYs and offers multiple uplink options, providing flexibility in network design.

2. Energy Efficiency: Incorporates energy-saving features like Energy Efficient Ethernet (EEE) to reduce power consumption during low traffic periods.
3. Advanced QoS and Traffic Management: Implements advanced Quality of Service (QoS) features and traffic management capabilities, ensuring optimized performance and prioritization of critical network traffic.
4. Security: Provides robust security features, such as Secure Boot, MACsec, and enhanced packet filtering, to protect against various network threats.
5. Scalability: Designed for a wide range of applications, from small to medium-sized enterprise networks to more extensive service provider deployments.
6. Integration and Cost-Effectiveness: Combines multiple functions onto a single chip, reducing the need for additional components and lowering overall system cost.
These features make it suitable for modern networking environments requiring efficient, secure, and flexible Ethernet switching solutions.

Pinout

The BCM56170B0IFSBG is part of the Broadcom StrataXGS series, specifically designed for Ethernet switch applications. While detailed specifications such as pin count and precise functions are typically found in the product datasheet, which is proprietary and requires access to technical resources or a non-disclosure agreement, general information can be provided.
This chip typically features:
- A high pin count typical of network switch ASICs, often exceeding 500 pins, to accommodate extensive connectivity and functionality requirements.
- Functions that include support for Ethernet switching, routing, and network management capabilities.
For accurate and tailored information, consulting the specific datasheet or product brief from Broadcom is recommended, as it provides detailed pin configurations, layout, and descriptions of each pin's function.

Manufacturer

The BCM56170B0IFSBG is manufactured by Broadcom Inc. Broadcom is a global technology company that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its products in the areas of data center, networking, software, broadband, wireless, and storage, among others. Broadcom's semiconductor solutions are used in various applications, including broadband access, data center networking, enterprise storage, and industrial automation. The company has a strong presence in the technology sector and is recognized for its innovation and contributions to the advancement of modern electronics and communications.

Application

The BCM56170B0IFSBG is a Broadcom network switch chip designed for high-performance Ethernet applications. It is commonly used in enterprise and data center environments due to its ability to handle large data loads efficiently. Key application areas include:
1. Enterprise Networking: Enhances network infrastructure with improved data throughput and reliability.
2. Data Centers: Supports high-density networking needs, facilitating fast data transfer and virtualization.
3. Cloud Computing: Optimizes network performance for cloud-based services and applications.
4. Telecommunications: Provides backbone support for telecom networks requiring robust data handling.
5. Edge Computing: Enables low-latency processing for IoT and edge devices by ensuring efficient data flow.
These applications leverage its capabilities in delivering scalable and high-speed network solutions.

Package

The BCM56170B0IFSBG uses a Fine-Pitch Ball Grid Array (FBGA) package type.

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