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BGA622L7E6327XTSA1
+Lista de MateriaisIC AMP 802.15 500MHZ-6GHZ TSLP7
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FabricanteTecnologias Infineon
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Peça do Fabricante #BGA622L7E6327XTSA1
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Ficha Técnica BGA622L7E6327XTSA1 DataSheet
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Pacote XFDFN-6
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Especificações
| Atributo | Valor |
| Supplier | Infineon Technologies |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| ProductStatus | Obsolete |
| Frequency | 500MHz ~ 6GHz |
| P1dB | -20dBm |
| Gain | 17.5dB |
| NoiseFigure | 0.95dB |
| RFType | 802.15/Bluetooth, ISM, WLAN, GSM, GPS, DCS, UMTS |
| Voltage-Supply | 2.75V |
| Current-Supply | 10mA |
| MountingType | Surface Mount |
| Package/Case | 6-XFDFN Exposed Pad |
Visão Geral
Description
The "BGA" in its name refers to the Ball Grid Array packaging, which is a type of surface-mount packaging used to permanently mount devices such as microprocessors. This packaging helps in managing space on printed circuit boards (PCBs) and offers good thermal and electrical performance.
The specific numbers and letters in the name denote the particular model and its specifications, which are essential for engineers when selecting components for their designs. Understanding the capabilities and limitations of the BGA622L7E6327XTSA1 is crucial for ensuring optimal performance and compatibility in various high-frequency applications.
Equivalent
Features
1. Frequency Range: Operates effectively in a broad frequency range, typically from several hundred MHz up to a few GHz, making it suitable for diverse RF applications.
2. Gain: Offers significant gain, which is crucial for amplifying weak signals in RF circuits.
3. Noise Figure: Designed with a low noise figure to minimize the introduction of additional noise, preserving signal integrity.
4. Linear Performance: Provides good linearity, ensuring minimal distortion of the signal, which is important for maintaining signal quality.
5. Power Efficiency: Features efficient power consumption, which is beneficial for battery-powered or portable applications.
6. Package: Available in a compact package, which is ideal for space-constrained applications.
7. Applications: Commonly used in wireless communication systems, including LTE, Wi-Fi, and other radio frequency applications.
Overall, the BGA622L7E6327XTSA1 is a versatile and efficient solution for RF amplification needs.
Pinout
The BGA622L7E6327XTSA1 has a pin count of 7. Its primary function is to amplify weak RF signals while adding minimal noise, which is crucial for improving the sensitivity and performance of RF front-end circuits in devices such as mobile phones, GPS, and other wireless communication systems.
The configuration of the pins in the BGA package is designed to optimize performance and facilitate easy integration into RF systems. For specific details regarding pin functions, electrical characteristics, and application circuits, it is advisable to refer to the datasheet or technical documentation provided by Infineon Technologies.