BGM111A256V2R

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BGM111A256V2R

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RF TXRX MOD BLUETOOTH CHIP SMD

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Especificações

Atributo Valor
Part Status Active
RF Family/Standard Bluetooth
Protocol Bluetooth v4.2
Modulation GFSK
Frequency 2.4GHz
Data Rate 1Mbps
Power - Output 8dBm
Sensitivity -92dBm
Serial Interfaces I2C, SPI, UART
Antenna Type Integrated, Chip
Utilized IC / Part EFR32BG
Memory Size 256kB Flash, 32kB RAM
Voltage - Supply 1.85V ~ 3.8V
Current - Receiving 8.7mA
Current - Transmitting 8.2mA
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C
Package / Case Module
Base Product Number BGM111
DigiKey Programmable Not Verified

Visão Geral

Description

The BGM111A256V2R is a Bluetooth Smart module designed for applications requiring robust wireless connectivity. Manufactured by Silicon Labs, it integrates the Bluetooth 4.2 stack and offers excellent RF performance with low power consumption, making it ideal for battery-operated devices. The module features an ARM Cortex-M4 processor with a floating-point unit, 256 KB of flash memory, and 32 KB of RAM, providing ample resources for developing complex applications.
Key features include a built-in antenna, multiple I/O interfaces such as UART, SPI, I2C, and GPIO, and support for peripheral devices, ensuring versatility in various applications. The module's compact form factor and ease of deployment make it suitable for wearables, smart home devices, and other IoT applications. The BGM111A256V2R is also supported by Silicon Labs’ software development tools and Bluetooth software stacks, simplifying the development process for engineers. Its FCC, IC, and CE certifications ensure compliance with international standards, facilitating a smooth integration into wireless-enabled products.

Equivalent

The BGM111A256V2R is a Bluetooth module from Silicon Labs. Equivalent products might include modules like the Nordic Semiconductor nRF52832, the Texas Instruments CC2640R2F, and the Cypress CYBT-343026-01. These alternatives offer similar Bluetooth functionality, but differences in specifications, software support, and hardware features should be considered to ensure compatibility with specific project requirements. Always verify compatibility by reviewing the datasheets and specifications of each module.

Features

The BGM111A256V2R is a Bluetooth Smart module designed for wireless communication applications. Key features include:
1. Bluetooth Compatibility: Supports Bluetooth 4.2 Low Energy (BLE), ensuring efficient and low-power wireless communication.

2. Integrated MCU: Contains a 32-bit ARM Cortex-M4 processor with a floating-point unit, providing robust processing capabilities.
3. Flash Memory: Comes with 256 kB of flash memory for application storage, allowing for flexible program development.
4. RAM: Equipped with 32 kB of RAM, supporting efficient data handling and temporary storage needs.
5. Radio Performance: Offers a transmit power of up to +8 dBm and a receiver sensitivity of -93 dBm, ensuring reliable communication range and quality.
6. Antenna Options: Includes an integrated antenna, simplifying design and reducing the need for external components.
7. Peripheral Interfaces: Features multiple GPIOs, UART, I2C, SPI, and ADC interfaces for versatility in connecting various peripherals.
8. Power Efficiency: Designed for low-power operation, suitable for battery-powered devices.
9. Certifications: Pre-certified for global use, streamlining regulatory approval processes.
These features make the BGM111A256V2R ideal for IoT applications, wearables, and other embedded systems requiring Bluetooth connectivity.

Pinout

The BGM111A256V2R is a Bluetooth Smart module from Silicon Labs. It comes in a compact form factor with a pin count of 32. The module is designed for wireless connectivity applications and includes a microcontroller with an integrated Bluetooth radio.
Key functions include:
1. Bluetooth Connectivity: Supports Bluetooth Low Energy (BLE) 4.2, facilitating wireless communication in IoT applications.
2. Microcontroller: Contains an ARM Cortex-M4 processor that handles both application and Bluetooth protocol stacks.
3. Integrated Antenna: Simplifies design by eliminating the need for an external antenna.
4. Peripheral Interfaces: Offers various interfaces like UART, SPI, I2C, PWM, and GPIO, allowing for versatile connectivity with other devices and sensors.
5. Integrated Memory: Includes flash memory and RAM for application storage and execution.
The BGM111A256V2R is suitable for applications like health and fitness devices, smart home products, and any application requiring efficient, low-power Bluetooth communication.

Manufacturer

The BGM111A256V2R is manufactured by Silicon Labs. Silicon Labs is a technology company that specializes in the design and development of semiconductors and software for various applications. The company focuses on providing solutions for Internet of Things (IoT) devices, wireless connectivity, and other electronic devices. Silicon Labs is known for its expertise in low-power devices, wireless communication protocols, and microcontroller units (MCUs). The company serves industries such as smart home, industrial automation, consumer electronics, and healthcare, among others.

Application

The BGM111A256V2R is a Bluetooth Low Energy (BLE) module commonly used in various applications due to its compact size, low power consumption, and robust performance. Key application areas include:
1. IoT Devices: Facilitates wireless connectivity in smart home devices, wearables, and industrial IoT solutions.
2. Health and Fitness: Powers fitness trackers, heart rate monitors, and other health monitoring devices.
3. Consumer Electronics: Used in remote controls, toys, and wireless peripherals.
4. Automotive: Supports in-car communication systems and Bluetooth-enabled vehicle accessories.
5. Smart Lighting: Enables wireless control and connectivity in smart lighting solutions.
6. Beacon Applications: Used in location-based services and proximity marketing.
Its versatility makes it suitable for a wide range of wireless communication needs.

Package

The BGM111A256V2R is a Bluetooth module from Silicon Labs, and its package type is a QFN32, which stands for Quad Flat No-Lead with 32 pins. This package type typically features a compact form factor suitable for surface-mount technology.

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