BGM113A256V2R

Imagens apenas para referência

BGM113A256V2R

+Lista de Materiais

RX TXRX MOD BLUETOOTH CHIP SMD

  • FabricanteLaboratórios de Silício

  • Peça do Fabricante #BGM113A256V2R

  • Pacote 36-SMDModule

  • Em Estoque2210

365 Garantia de Qualidade em 1 dia

7*24 Garantia de serviço em 24 horas

90-Garantia de pós-venda em 1 dia

Garantia de Produto Genuíno

Especificações

Atributo Valor
Package Tape & Reel (TR),Cut Tape (CT)
Series Blue Gecko
ProductStatus Active
RFFamily/Standard Bluetooth
Protocol Bluetooth v4.1
Frequency 2.4GHz
DataRate 1Mbps
Power-Output 3dBm
Sensitivity -93dBm
SerialInterfaces SPI, UART
AntennaType Integrated, Chip
UtilizedIC/Part EFR32BG
MemorySize 256kB Flash, 32kB RAM
Voltage-Supply 3.8V
Current-Receiving 8.7mA
Current-Transmitting 8.8mA
MountingType Surface Mount
OperatingTemperature -40°C ~ 85°C

Visão Geral

Description

The BGM113A256V2R is a Bluetooth Low Energy (BLE) module developed by Silicon Labs. It is designed for easy integration into wireless applications, offering a compact and efficient solution for Bluetooth connectivity. The module features an ARM Cortex-M4 processor, providing the capability for both application and network processing. With 256 KB of flash memory and 32 KB of RAM, it supports the development of sophisticated BLE applications.
The BGM113A256V2R supports Bluetooth 4.2 and offers various interfaces such as UART, SPI, and I2C, facilitating communication with other devices and sensors. It is engineered for low power consumption, making it suitable for battery-operated devices and Internet of Things (IoT) applications. The module is pre-certified, simplifying regulatory compliance for developers. Additionally, its small form factor makes it ideal for compact device designs.
Silicon Labs provides development tools and software, including the BGScript scripting language, to enable rapid development and deployment of Bluetooth applications. Overall, the BGM113A256V2R is a versatile module for developers looking to incorporate BLE functionality into their products.

Equivalent

The BGM113A256V2R is a Bluetooth module from Silicon Labs. Equivalent products typically include other Bluetooth Low Energy (BLE) modules with similar specifications. Key alternatives are the Nordic Semiconductor nRF52832, Texas Instruments CC2640R2F, and Dialog Semiconductor DA14580. These modules offer comparable Bluetooth Low Energy capabilities and are suitable for use in similar applications, like IoT devices, wearables, and smart home products. Always check specific requirements like power consumption, range, and peripheral support when selecting an equivalent.

Features

The BGM113A256V2R is a compact, Bluetooth Low Energy (BLE) module designed for easy integration into wireless communication applications. Key features include:
1. Bluetooth 4.2 Compliance: Supports BLE 4.2, ensuring compatibility with a wide range of Bluetooth devices.
2. Low Power Consumption: Optimized for energy-efficient operation, ideal for battery-powered devices.
3. Integrated Antenna: Built-in antenna simplifies design and reduces the need for external components.
4. 32-bit ARM Cortex-M4 Processor: Provides robust processing power for complex applications.
5. Up to 256 KB Flash Memory: Allows for ample storage of application code and data.
6. Peripheral Interfaces: Includes UART, SPI, I2C, and GPIOs for flexible connectivity.
7. Compact Size: Small form factor (12.9 mm x 15.0 mm x 2.2 mm), making it suitable for space-constrained applications.
8. Security Features: Offers secure connections with AES encryption.
9. Development Tools: Supported by Silicon Labs' software and tools for simplified development and deployment.
10. Wide Operating Temperature Range: Suitable for diverse environments (-40°C to +85°C).
These features make the BGM113A256V2R an excellent choice for IoT, wearable, and smart device applications.

Pinout

The BGM113A256V2R is a Bluetooth Smart Module from Silicon Labs designed for embedding in a variety of wireless applications. It operates using a 32-bit ARM® Cortex®-M4 processor with a 256 kB flash memory and 32 kB RAM.
The module typically has 32 pins, though the specific pin count and configuration can vary depending on the application and package type. Its key functions include providing Bluetooth connectivity with low energy consumption, making it suitable for applications like IoT devices, health and fitness products, and smart home applications. The BGM113 module supports both central and peripheral roles, and it offers features such as hardware cryptography, a hardware random number generator, and various GPIOs for peripheral connections. Additionally, it has integrated antenna and RF matching components for simplified design. For detailed pin configuration and functions, consulting the manufacturer's datasheet is recommended.

Manufacturer

The BGM113A256V2R is manufactured by Silicon Labs. Silicon Labs is a technology company that specializes in designing and manufacturing semiconductors and software for various applications, including Internet of Things (IoT) devices, internet infrastructure, industrial automation, consumer electronics, and automotive markets. The company is known for its focus on energy-friendly products and solutions that integrate hardware and software to address complex technological challenges.

Application

The BGM113A256V2R is a Bluetooth Smart Module commonly used in various wireless communication applications. Its application areas include:
1. Wearable Devices: For fitness trackers and health monitoring devices, enabling Bluetooth connectivity.
2. IoT Devices: Facilitates wireless communication in smart home devices like sensors and controllers.
3. Remote Controls: Used in Bluetooth-enabled remote control applications for consumer electronics.
4. Beacons: Ideal for location-based services and indoor navigation systems.
5. Automotive: Provides connectivity for in-car systems and diagnostics.
6. Healthcare: Used in medical devices for wireless data transfer and monitoring.
7. Industrial Automation: Enables machine-to-machine communication in industrial settings.
Its compact form and low power consumption make it versatile for embedded applications.

Package

The BGM113A256V2R is a module with a system-in-package (SiP) format. It integrates a Bluetooth Low Energy (BLE) radio and microcontroller, designed for compact and efficient wireless communication.

Produtos relacionados a BGM113A256V2R