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BSS169H6327XTSA1
+Lista de MateriaisMOSFET N-CH 100V 170MA SOT23-3
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FabricanteTecnologias Infineon
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Peça do Fabricante #BSS169H6327XTSA1
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Ficha Técnica BSS169H6327XTSA1 DataSheet
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Pacote SOT-23-3
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Especificações
| Atributo | Valor |
| Package / Case | Tape & Reel (TR),Cut Tape (CT) |
| Series | SIPMOS® |
| Part Status | Active |
| FET Type | N-Channel |
| Technology | MOSFET (Metal Oxide) |
| Drain to Source Voltage (Vdss) | 100 V |
| Current - Continuous Drain(Id) @ 25°C | 170mA (Ta) |
| Drive Voltage(Max Rds On Min Rds On) | 0V, 10V |
| Rds On(Max) @ Id Vgs | 6Ohm @ 170mA, 10V |
| Vgs(th)(Max) @ Id | 1.8V @ 50µA |
| Gate Charge(Qg)(Max) @ Vgs | 2.8 nC @ 7 V |
| Vgs(Max) | ±20V |
| Input Capacitance(Ciss)(Max) @ Vds | 68 pF @ 25 V |
| FET Feature | Depletion Mode |
| Power Dissipation (Max) | 360mW (Ta) |
| Operating Temperature | -55°C ~ 150°C (TJ) |
| Mounting Type | Surface Mount |
| Supplier Device Package | PG-SOT23 |
Visão Geral
Description
Key features of BSS169H6327XTSA1 may include low on-resistance, fast switching capabilities, and a compact surface-mount package, making it ideal for space-constrained applications. The device is typically used in circuits where efficiency and reliability are critical, such as in automotive systems, renewable energy setups, and consumer electronics.
Understanding the specifications and applications of this component requires consulting the detailed datasheet provided by Infineon, which includes electrical characteristics, thermal performance data, and usage guidelines. This ensures optimal integration into electronic designs and helps meet specific operational requirements of the intended application. Always verify the part's specifications to ensure it aligns with your project's needs.
Equivalent
Features
1. N-Channel MOSFET: It conducts when a positive voltage is applied to the gate relative to the source.
2. Voltage and Current Ratings: Typically supports low to medium voltage applications, commonly around 50V and a few amperes of current.
3. Low On-Resistance (Rds(on)): Offers efficient performance with minimal power loss and heat generation.
4. Small Package Size: Usually comes in a compact SOT-23 package, making it suitable for space-constrained designs.
5. High-Speed Switching: Capable of handling fast switching operations, making it ideal for high-frequency applications.
6. Applications: Often used in switching applications, battery-powered devices, and DC-DC converters.
7. Thermal Performance: Designed to provide efficient thermal management in a small footprint.
This MOSFET is commonly utilized in various electronic circuits requiring efficient power management and switching capabilities. Always refer to the datasheet for specific electrical characteristics and maximum ratings.
Pinout
1. Gate (G): This pin is used to control the MOSFET's switching. Applying a voltage to the gate can turn the MOSFET on or off.
2. Source (S): This is the terminal through which the current enters the MOSFET when it is in the on state.
3. Drain (D): This is the terminal through which the current exits the MOSFET.
The BSS169 is commonly used for switching and amplification purposes in low-power electronic circuits. It features low on-resistance and fast switching characteristics, making it suitable for various applications such as signal processing and voltage regulation. Always refer to the manufacturer's datasheet for detailed specifications and application guidelines.
Manufacturer
Application
1. Switching Circuits: Utilized in high-speed switching applications due to its fast switching capability.
2. Amplifiers: Employed in low-power amplification circuits.
3. Signal Processing: Used in signal modulation and demodulation tasks.
4. Battery Management: Suitable for battery protection and management systems.
5. Consumer Electronics: Integrated into devices for efficient power management.
6. Telecommunications: Used in RF applications and signal routing.
7. Automotive: Implemented in various automotive electronic systems for control and power management.
Its versatility and efficiency make it ideal for compact and energy-efficient designs.