CDCM1802RGTR

The CDCM1802RGTR is a high-performance clock generator and synchronizer IC from Texas Instruments. It generates low-jitter output clocks from a reference input, supporting frequencies up to 200 MHz. Key features include:
- Inputs: Accepts LVCMOS, LVPECL, LVDS, or HCSL references.
- Outputs: Provides up to 8 configurable LVCMOS/LVDS outputs.
- Jitter Performance: Ultra-low additive jitter (< 0.3 ps RMS).
- Flexibility: Programmable output frequencies via I²C or pin-strapping.
- Applications: Ideal for networking, telecom, and high-speed data converters.
Packaged in a 24-pin QFN (RGTR), it operates from a 3.3V supply and includes power-down modes for energy efficiency.
For detailed specs, refer to the [TI datasheet](https://www.ti.com).

Equivalent products to the CDCM1802RGTR (a clock buffer/fanout driver from Texas Instruments) include:
- CDCM1804RGTR (similar specs, different output count)
- LMK00301 (higher performance, TI)
- NB3N551 (ON Semiconductor)
- SY89833LMG (Microchip)
- 9DBL0451 (Renesas)
Check datasheets for exact compatibility in voltage, speed, and pinout.

The CDCM1802RGTR is a high-performance clock buffer with the following key features:
- Inputs: Supports LVCMOS, LVTTL, or LVPECL reference clocks (3.3V or 2.5V).
- Outputs: 8 low-skew, low-jitter LVCMOS outputs (individually configurable).
- Frequency Range: Up to 200 MHz.
- Low Additive Jitter: Typically < 0.5 ps RMS (12 kHz – 20 MHz).
- Low Output Skew: < 50 ps (output-to-output).
- Supply Voltage: 3.3V or 2.5V operation.
- Power Consumption: Low power, typically < 50 mA (3.3V).
- Package: 16-pin QFN (RGTR).
- Applications: Networking, telecom, and high-speed digital systems.
Compact and efficient, it ensures precise clock distribution with minimal signal degradation.

The CDCM1802RGTR is packaged in a QFN-16 (Quad Flat No-Lead) type. This compact, surface-mount package measures 3mm × 3mm with a height of 0.8mm, offering efficient thermal performance and space-saving benefits for high-frequency clock distribution applications. The QFN design includes exposed pads for improved heat dissipation and electrical grounding.