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CSD95372BQ5MC
+Lista de MateriaisPOWER STAGE DESIGN FOR DUAL COOL
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FabricanteTexas Instruments
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Peça do Fabricante #CSD95372BQ5MC
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Pacote VSON12
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Especificações
| Atributo | Valor |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Series | NexFET™ |
| ProductStatus | Active |
| OutputConfiguration | Half Bridge |
| Applications | Synchronous Buck Converters |
| Interface | PWM |
| LoadType | Inductive |
| Technology | Power MOSFET |
| Current-Output/Channel | 60A |
| Current-PeakOutput | 90A |
| Voltage-Supply | 4.5V ~ 5.5V |
| Voltage-Load | 4.5V ~ 16V |
| OperatingTemperature | -55°C ~ 150°C (TJ) |
| Features | Bootstrap Circuit, Status Flag |
| FaultProtection | Current Limiting, Over Temperature, Shoot-Through, Short Circuit, UVLO |
| MountingType | Surface Mount |
| Package/Case | 12-PowerTFDFN |
Visão Geral
Description
The CSD95372BQ5MC is part of a series that focuses on optimizing performance and reducing the footprint in applications such as servers, telecom, and industrial power supplies. It usually incorporates high-efficiency MOSFETs and a driver IC into a compact, thermally optimized package. This integration minimizes parasitic inductances, enhances thermal performance, and simplifies the design process.
Key features generally include low on-resistance, high-speed operation, and robust thermal management capabilities. These characteristics make it well-suited for applications requiring high efficiency and reliability. It's important to consult the specific datasheet for the CSD95372BQ5MC for detailed specifications and application guidelines.
Equivalent
Features
1. Integrated Solution: Combines driver IC and power MOSFETs in a single package, offering high efficiency and simplified design.
2. High Efficiency: Optimized for high switching frequencies, reducing power losses and improving overall system efficiency.
3. Current Rating: Capable of handling high continuous current, suitable for demanding power supply applications.
4. Low Parasitic Inductance: The optimized package design reduces parasitic inductance, enhancing performance at high frequencies.
5. Thermal Performance: Enhanced thermal performance for better heat dissipation and reliability in compact designs.
6. Protection Features: Includes over-temperature and over-current protection to ensure safe operation under various conditions.
7. Compact Package: Comes in a small, 5x6 mm QFN package, enabling space-saving designs.
8. Applications: Ideal for use in computing, telecommunications, and other applications requiring efficient power conversion.
These features make the CSD95372BQ5MC suitable for high-performance power management applications.
Pinout
The CSD95372BQ5MC features a total of 12 pins. The primary functions of these pins include:
1. VIN - Input voltage supply for the power stage.
2. SW - Switch node connection to the output inductor.
3. BOOT - Supply input for the high-side FET gate driver.
4. GND - Ground connection.
5. VDD - Supply voltage input for internal logic and drivers.
6. PWM - PWM input signal for controlling the power stage.
7. ENABLE - Enable signal to turn the device on or off.
8. VDRV - Driver supply to provide a voltage for the internal gate drive circuitry.
9. GL/GLS - Low-side gate drive output (may be split into separate pins depending on package configuration).
10. GH/GHS - High-side gate drive output (may be split into separate pins depending on package configuration).
These pins work together to provide efficient power conversion by controlling the switching of the internal MOSFETs.