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CY7C1370D-167AXC
+Lista de MateriaisIC SRAM 18MBIT PAR 100TQFP
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FabricanteTecnologias Infineon
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Peça do Fabricante #CY7C1370D-167AXC
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Especificações
| Atributo | Valor |
| Series | NoBL™ |
| Part Status | Obsolete |
| Digi Key Programmable | Not Verified |
| Memory Type | Volatile |
| Memory Format | SRAM |
| Technology | SRAM - Synchronous, SDR |
| Memory Size | 18Mbit |
| Memory Organization | 512K x 36 |
| Memory Interface | Parallel |
| Clock Frequency | 167 MHz |
| Access Time | 3.4 ns |
| Voltage - Supply | 3.135V ~ 3.6V |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 100-LQFP |
| Supplier Device Package | 100-TQFP (14x20) |
| Base Product Number | CY7C1370 |
Visão Geral
Description
The CY7C1370D-167AXC is a high-performance static RAM (SRAM) device from Cypress Semiconductor, featuring a 256K x 18-bit memory architecture. It operates at a maximum clock speed of 167 MHz, making it suitable for applications requiring fast data access. This SRAM is designed for low latency and high throughput, ideal for use in networking, telecommunications, and high-speed computing applications.
Key features include a wide operating voltage range of 2.7V to 3.6V, which allows for flexibility in various systems. It supports asynchronous read and write operations, facilitating ease of integration into existing designs. The device also includes a burst mode for efficient data transfer, enhancing performance in high-demand scenarios.
With a 54-pin TSOP II package, the CY7C1370D-167AXC is compact and provides good thermal and electrical performance. Overall, this SRAM solution is well-suited for applications that require reliable, high-speed data storage and processing capabilities.
Key features include a wide operating voltage range of 2.7V to 3.6V, which allows for flexibility in various systems. It supports asynchronous read and write operations, facilitating ease of integration into existing designs. The device also includes a burst mode for efficient data transfer, enhancing performance in high-demand scenarios.
With a 54-pin TSOP II package, the CY7C1370D-167AXC is compact and provides good thermal and electrical performance. Overall, this SRAM solution is well-suited for applications that require reliable, high-speed data storage and processing capabilities.
Equivalent
The CY7C1370D-167AXC is a synchronous SRAM chip. Equivalent products include:
1. IS61WV51216BLL-167B3 (ISSI)
2. MT48LC16M16A2P-75 (Micron)
3. K4S281632H-667 (Samsung)
4. IDT71V36100S75 (Integrated Device Technology)
Always verify specific parameters like package type, timing, and voltage to ensure compatibility.
1. IS61WV51216BLL-167B3 (ISSI)
2. MT48LC16M16A2P-75 (Micron)
3. K4S281632H-667 (Samsung)
4. IDT71V36100S75 (Integrated Device Technology)
Always verify specific parameters like package type, timing, and voltage to ensure compatibility.
Features
The CY7C1370D-167AXC is a high-performance SRAM (Static Random Access Memory) device from Cypress Semiconductor, featuring the following key attributes:
1. Density: 1 Mbit (128K x 8).
2. Access Time: 167 ns, allowing for quick data retrieval.
3. Interface: Parallel interface for easy integration with various systems.
4. Operating Voltage: Typically operates at 2.5V or 3.3V, ensuring low power consumption.
5. Package Type: Available in a 44-pin TSOP II package, suitable for space-constrained applications.
6. Asynchronous Read/Write: Allows for simple control and flexibility in data handling.
7. Low Power: Designed for low standby and active power consumption.
8. Durability: Supports a high number of read/write cycles, making it reliable for demanding applications.
This SRAM is ideal for applications requiring fast, temporary storage, such as networking equipment, telecommunications, and industrial control systems.
1. Density: 1 Mbit (128K x 8).
2. Access Time: 167 ns, allowing for quick data retrieval.
3. Interface: Parallel interface for easy integration with various systems.
4. Operating Voltage: Typically operates at 2.5V or 3.3V, ensuring low power consumption.
5. Package Type: Available in a 44-pin TSOP II package, suitable for space-constrained applications.
6. Asynchronous Read/Write: Allows for simple control and flexibility in data handling.
7. Low Power: Designed for low standby and active power consumption.
8. Durability: Supports a high number of read/write cycles, making it reliable for demanding applications.
This SRAM is ideal for applications requiring fast, temporary storage, such as networking equipment, telecommunications, and industrial control systems.
Pinout
The CY7C1370D-167AXC is a 256K x 18 dual-port SRAM from Cypress Semiconductor. It has a pin count of 64.
Key functions of the pins include:
1. Data Inputs/Outputs: DQ0-DQ17 (18 pins) for data.
2. Address Inputs: A0-A17 (18 pins) for addressing the memory locations.
3. Control Signals:
- WE (Write Enable) to control write operations.
- OE (Output Enable) to control data output.
- CE (Chip Enable) to activate the chip.
- LB (Lower Byte Enable) and UB (Upper Byte Enable) to control byte access.
4. Power and Ground: VCC and GND pins for power supply.
5. Additional Control Pins:
- WEN (Write Enable for the secondary port).
- R/W (Read/Write control).
- DPA (Data Port A) and DPB (Data Port B) for dual-port operations.
The device operates at 167 MHz speed, providing high-performance data access.
Key functions of the pins include:
1. Data Inputs/Outputs: DQ0-DQ17 (18 pins) for data.
2. Address Inputs: A0-A17 (18 pins) for addressing the memory locations.
3. Control Signals:
- WE (Write Enable) to control write operations.
- OE (Output Enable) to control data output.
- CE (Chip Enable) to activate the chip.
- LB (Lower Byte Enable) and UB (Upper Byte Enable) to control byte access.
4. Power and Ground: VCC and GND pins for power supply.
5. Additional Control Pins:
- WEN (Write Enable for the secondary port).
- R/W (Read/Write control).
- DPA (Data Port A) and DPB (Data Port B) for dual-port operations.
The device operates at 167 MHz speed, providing high-performance data access.
Manufacturer
The CY7C1370D-167AXC is manufactured by Cypress Semiconductor Corporation, a subsidiary of Infineon Technologies AG. Cypress specializes in designing and producing a wide range of semiconductor products, including memory solutions, microcontrollers, and programmable system-on-chip (PSoC) devices. The company is known for its focus on embedded systems and connectivity solutions, catering to various industries such as automotive, industrial automation, consumer electronics, and IoT (Internet of Things). Cypress products are widely used in applications that require reliable and high-performance electronic components.
Application
The CY7C1370D-167AXC is a high-speed SRAM (Static Random Access Memory) chip widely used in various application areas, including networking devices, telecommunications, and high-performance computing. It is ideal for cache memory, buffer memory in data communication systems, and applications requiring fast data access and processing. Additionally, it is used in embedded systems, industrial automation, and automotive electronics, where rapid data storage and retrieval are crucial. Its low power consumption and high-speed capabilities make it suitable for performance-sensitive applications.
Package
The CY7C1370D-167AXC is packaged in a 32-pin TQFP (Thin Quad Flat Package) form factor. This compact package is designed for high-density applications, providing a combination of performance and space efficiency.
